Winged Coil Structure Thermal Pressing Alignment

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Solution Overview

Problem

Traditional rigid circuit boards are inflexible and lack the ability to conform to specific geometries, and the alignment of coils and flexible plates in magnetic induction coils is prone to mismatch, affecting electrical performance and increasing occupied area.

Innovation Solution

A winged coil structure is manufactured using thermal pressing to integrate upper and lower magnetic induction coils with connection plugs and notched lines on the flexible plate, allowing for a flexible and bendable design without alignment issues, enhancing magnetic induction efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If traditional rigid circuit boards are used, then mechanical strength and electrical insulation are good, but flexibility and bendability are lost

Engineering Contradiction:
Improvemechanical strengthVSAvoidflexibility
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The rigid circuit board is divided into a rigid base board and separate flexible coil structures. The coils are detached from the rigid board and mounted on flexible substrates, allowing the coils to bend independently while the base board maintains structural integrity. This segmentation resolves the contradiction by enabling flexibility in the coil assembly without compromising the mechanical strength of the overall device.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The coil structures are designed to be dynamically flexible while the base board remains statically rigid. The flexible substrates allow the coils to change shape and position, providing adaptability for different spatial configurations, while the rigid base board provides stable mechanical support and electrical insulation.

Inventive Principle:
Principle #15Dynamics

2Ease of manufacture

If coils and flexible plates are attached separately with through-holes, then assembly is possible, but alignment mismatch affects electrical performance

Engineering Contradiction:
Improveassembly capabilityVSAvoidalignment accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The coil structures and flexible substrates are combined into an integrated unit before mounting to the rigid base board. The coils are pre-assembled with their flexible substrates using adhesive layers, creating a unified assembly that eliminates the need for separate alignment of coils and substrates during final assembly. This merging approach maintains manufacturing ease while achieving precise alignment.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The alignment and attachment of coils to flexible substrates are performed in advance during the coil assembly process, before the entire assembly is mounted to the rigid base board. This preliminary action ensures precise alignment is achieved when it matters most, while the final assembly step remains simple and easy to manufacture.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If multiple coils are manufactured on the same surface of the flexible plate, then magnetic induction range is enlarged, but occupied area increases

Engineering Contradiction:
Improvemagnetic induction effectivenessVSAvoidoccupied area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

Multiple coils are arranged in a three-dimensional stacked configuration rather than being laid out on the same two-dimensional surface. The flexible substrates allow coils to be positioned at different heights and angles, creating a compact 3D structure that provides extensive magnetic induction coverage in multiple directions without requiring large planar area. This dimensional transition resolves the contradiction between magnetic induction effectiveness and area occupation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The winged coil structure provides enhanced magnetic induction with reduced area usage and improved flexibility, overcoming alignment challenges and increasing industrial utility.

Implementation Method 1

The connection plug possessing the aspect of workability of thermal process is employed to tightly combine the upper and lower connection pads

Methodology Applied
Scientific EffectThermal pressing: Heating

Implementation Method 2

performing a process of thermal pressing to sequentially from bottom to top stack and combine the lower flexible plate, the dielectric layer, and the upper flexible plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the winged coil structure exhibits the flexible and bendable feature. In particular, the upper, lower and bottom magnetic induction coils are integrated as a multiple layers stack structure... The effect of magnetic induction is greatly enhanced

Methodology Applied
Scientific EffectMagnetic induction: Electromagnetic Induction

Data Source

PatentUS10366822B2Method of manufacturing winged coil structure
Publication Date: 2019.07.30 KINSUS INTERCONNECT TECH
  • US10366822B2 patent drawing
  • US10366822B2 patent drawing
  • US10366822B2 patent drawing

AI summary

A method of manufacturing a winged coil structure is provided. The method includes preparing an upper flexible plate having a middle region and two side regions bordering the middle region; preparing a dielectric layer with a lateral size of the dielectric layer being the same as a lateral size of the middle region of the upper flexible plate; preparing a lower flexible plate having a middle region and two side regions bordering the middle region; preparing a bottom flexible plate attached to the lower surface of the lower flexible plate to form a stack body; and performing a process of thermal pressing to sequentially from bottom to top stack and combine the stack body, the dielectric layer, and the upper flexible plate as a multiple layered stack structure via a press mold.