Winged Pick Arm Sloping Surface Reduces Air Turbulence
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-speed pick and place operations in semiconductor die attachment processes face challenges due to air turbulence and vibrations caused by rapid movements of the pick arm, leading to inaccurate picking and placement of semiconductor dice, which reduces throughput.
Innovation Solution
A pick arm design featuring a winged part with a sloping surface that reduces air turbulence by inclining from the top to the bottom, minimizing pressure differentials and vibrations on the adhesive film, allowing for faster and more accurate operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick arm rotates at high speeds to improve throughput, then productivity increases, but air turbulence and vibrations increase causing manufacturing precision to deteriorate
Solution Approach 1:
The patent converts the harmful air turbulence generated by high-speed pick arm rotation into a beneficial controlled airflow pattern. The winged part with its specific geometry (sloping surface inclined between top and bottom portions) redirects the turbulent air flow to reduce vibrations on the adhesive film, thereby converting the harmful effect of high-speed rotation into a controlled airflow that actually helps stabilize the picking process.
Solution Approach 2:
The patent changes the geometric parameters of the pick arm by introducing a winged part with specific dimensions and angles. The sloping surface is configured with particular inclination angles between the top and bottom portions relative to the longitudinal axis, optimizing the airflow characteristics to minimize vibrations while maintaining high-speed operation capability.
2Speed
If the pick arm rotates rapidly to reduce operation time, then speed improves, but adhesive film vibrations increase causing reliability to deteriorate
Solution Approach 1:
The winged part converts the harmful vibrations caused by rapid rotation into a beneficial controlled airflow pattern. By redirecting the air turbulence through its specially designed sloping surfaces, the structure transforms the unstable airflow into a more predictable flow pattern that reduces film vibrations and improves operational reliability.
Solution Approach 2:
The winged part is designed to preemptively counteract the harmful vibrations before they can significantly impact the adhesive film. The sloping surfaces are positioned and angled to intercept and redirect turbulent air flows before they reach the film, preventing vibrations rather than merely reducing them after they occur.
3Productivity
If the pick arm moves rapidly between pick-up and placement locations to improve productivity, then throughput increases, but air pressure differences cause adhesive film vibrations that require waiting time, reducing speed
Solution Approach 1:
The patent converts the harmful air pressure differences generated during rapid pick arm movement into a beneficial controlled airflow pattern. The winged part's sloping surfaces redirect the pressure-driven air flows to minimize vibrations on the adhesive film, eliminating the need for waiting periods and maintaining continuous high-speed operation.
Solution Approach 2:
The winged part enables continuous pick and place operations by preventing vibrations that would otherwise force the system to pause. By continuously managing the airflow and pressure differences during the entire rotation cycle, the structure ensures uninterrupted operation, maintaining both high speed and high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces air turbulence and vibrations, enabling the pick arm to operate accurately at high speeds without waiting for adhesive film vibrations to cease, thus enhancing throughput and accuracy in semiconductor die handling.
Implementation Method 1
These rapid movements of the pick arm create air turbulence and/or air pressure differences in the air above the adhesive film
Data Source
AI summary
A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.


