Wire Biasing Tool for Precise Low-Loop Wire Bonding
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Solution Overview
Problem
Existing wire bonding systems face challenges in accurately forming low wire loops with heavy bonding wires, such as aluminum, which affects the consistency and minimization of the height of assembled electronic packages.
Innovation Solution
A wire bonding system incorporating a wire biasing tool with a rotary actuator and four-bar linkage mechanism to apply a biasing force on the bonding wire, ensuring precise control and alignment during the bonding process, thereby forming accurate and low wire loops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire bonding system uses heavy bonding wires (such as aluminum wire) for high power electronic packages, then the electrical interconnection capability is improved, but the manufacturing precision of wire loop formation deteriorates
Solution Approach 1:
The wire biasing tool applies a biasing force to the bonding wire in advance before the bonding process, pre-positioning the wire to follow the desired travel path. This preliminary action ensures that when the wire is subsequently bonded, it already follows the correct trajectory, achieving precise wire loop formation with heavy wires that would otherwise be difficult to control
Solution Approach 2:
The wire biasing tool acts as an intermediary between the wire feeding mechanism and the bonding tool. It provides a controlled interaction point where the biasing force is applied to the wire, mediating the wire's path and position before it reaches the bonding tool, thereby enabling precise control of heavy wires during the bonding process
2Length of moving object
If the wire loop height is minimized to reduce assembled package height, then the compactness is improved, but the consistency and accuracy of wire loop formation deteriorates
Solution Approach 1:
The system uses a rotary actuator with a linkage mechanism that provides controlled feedback on the wire biasing tool's position and force application. This feedback mechanism ensures that the biasing force is consistently applied at the correct magnitude and direction throughout the wire bonding process, achieving both minimal wire loop height and high formation consistency across multiple bonds
Solution Approach 2:
The wire biasing tool dynamically adjusts the biasing force parameters (magnitude and direction) based on the bonding process requirements. By changing these parameters in a controlled manner, the system achieves optimal wire loop formation with minimal height while maintaining consistency across different bonding locations
3Manufacturing precision
If a wire biasing tool with rotary actuator and linkage mechanism is added to apply biasing force on bonding wire, then the manufacturing precision of wire loop formation is improved, but the device complexity increases
Solution Approach 1:
The wire biasing tool with rotary actuator and linkage mechanism is designed to perform multiple functions: it applies biasing force, controls wire position, and guides wire trajectory. This multi-functionality consolidates several control functions into a single integrated tool, improving wire loop formation precision while limiting the increase in overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves greater accuracy and consistency in wire loop formation, reducing the height of assembled electronic packages and enhancing the repeatability and precision of the bonding process.
Implementation Method 1
a rotary actuator operatively connected to the wire biasing tool by a linkage mechanism, the rotary actuator being operable to move the wire biasing tool along a predetermined travel path to apply a biasing force onto a length of bonding wire
Implementation Method 2
the bonding process may involve the application of force and ultrasonic energy at a tip of the wedge tool to form an intermetallic connection between the bond pad of a semiconductor die or a lead and the bonding wire
Data Source
Figure 1
Figure 2A~2C
Figure 3A~3E
AI summary
A wire bonding system has a bonding tool and a wire guide for guiding a bonding wire to a tip of the bonding tool for conducting wire bonding operations. A wire biasing tool is located adjacent to the wire guide, and a rotary actuator is operatively connected to the wire biasing tool by a linkage mechanism. The rotary actuator is operable to move the wire biasing tool along a predetermined travel path to apply a biasing force onto a length of bonding wire extending from the tip of the bonding tool.