Semiconductor Wire-Bond Adapter Layout to Prevent Electrical Shorting
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Solution Overview
Problem
Conventional semiconductor devices with high metal wire density are prone to electric shorting, which poses a significant challenge for industries aiming to reduce this issue.
Innovation Solution
The semiconductor device incorporates an adapter disposed on a carrier, with first and second metal wires connecting the electronic component to the adapter and the adapter to the carrier, respectively, reducing wire length and density to prevent electrical shorting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of metal wires is increased to connect electronic components, then the connectivity and functionality are improved, but the wire density increases which causes electric shorting
Solution Approach 1:
The patent introduces an adapter as an intermediary component between the electronic component and the carrier. The adapter provides additional connection points and routing options, allowing multiple metal wires to connect to the adapter rather than directly to the carrier, thereby distributing wire density and reducing shorting risks while maintaining high connectivity
Solution Approach 2:
The patent segments the connection system by introducing an adapter that divides the direct connection path into multiple segments (electronic component to adapter, adapter to carrier). This segmentation allows for better spatial distribution of metal wires and reduces the density of wires in any single region, preventing electric shorting
2Reliability
If an adapter is introduced to reduce wire density, then the risk of electric shorting is reduced, but the device complexity increases
Solution Approach 1:
The adapter serves multiple functions: it provides additional connection points for metal wires, acts as a mounting platform, and facilitates wire routing. By consolidating these functions into a single component, the overall device complexity is minimized while still achieving the goal of reducing wire density and preventing electric shorting
Data Source
AI summary
A semiconductor device is provided. The semiconductor device includes a carrier, an electronic component, an adapter, a first metal wire and a second metal wire. The electronic component is disposed on the carrier. The adapter is disposed on the carrier. The first metal wire connects the electronic component and the adapter. The second metal wire connects the adapter and the carrier.