Wire Bond Inspection by Bond Area and Symmetry Analysis
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Solution Overview
Problem
Conventional methods for inspecting wire bonding in battery systems are destructive and fail to accurately detect defects, particularly underbonding, due to differences in bonding portion shape and area between battery systems and semiconductor processes.
Innovation Solution
A non-destructive method involving photography of the bonding portion, calculation of its area, and comparison with normal data to determine defects, including symmetry analysis for enhanced accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a pulling inspection method is used to measure tensile strength of wire bonding, then tensile strength can be measured, but the wire bonding portion is destroyed and only sampling inspection is possible
Solution Approach 1:
The patent replaces the mechanical pulling inspection method with an optical imaging system. A camera captures images of the bonding portion, and image processing algorithms calculate the bonding area and shape characteristics. This substitution eliminates the need for physical destruction while providing comprehensive inspection of all wire bonding portions, thereby maintaining measurement capability while improving inspection coverage to 100%.
2Ease of manufacture
If conventional inspection methods from semiconductor process are applied to battery system wire bonding, then inspection can be performed, but detection accuracy is insufficient due to differences in bonding portion shape and area
Solution Approach 1:
The patent develops inspection criteria specifically tailored to battery system wire bonding characteristics. Instead of using generic semiconductor inspection standards, the system calculates bonding area ratios, shape factors, and other geometric parameters that are specific to battery applications. This localized approach to inspection criteria ensures high detection accuracy for battery-specific defects such as underbonding and overbonding, while maintaining ease of implementation through automated image processing.
Data Source
Figure 1~2
AI summary
The present invention relates to a wire bonding inspection method to inspect whether a wire bonding applied to a battery system is defective using a non-destructive method, the wire bonding inspection method including a) photographing a wire bonding portion using a camera, b) calculating the area of the bonding portion, and c) determining whether the wire bonding is defective based on the calculated area of the bonding portion.