Wire Bond Package Layout Over a Substrate Cavity

The patent transitions wire bond routing from a planar path through the substrate to a three-dimensional path using vias and over-the-cavity routing. Wire bonds are routed through vias to intermediate layers or routed over the cavity surface, changing the dimensional approach from 2D substrate traversal to 3D spatial utilization, thereby reducing the effective substrate thickness requirement while maintaining electrical connectivity.

The patent introduces intermediate structures such as via holes, intermediate conductive layers, and cavity surfaces as mediators for wire bond routing. These intermediary elements enable electrical connections without requiring wires to traverse the entire substrate thickness, allowing segmentation of the connection path and reduction of signal loss while maintaining reliable electrical connectivity.

The patent segments the interconnection system into multiple independent components: pillar interconnects for vertical connections, solder interconnects for bonding, wire bonds for lateral connections, and cavity structures for routing. This segmentation allows each component to be optimized independently and enables high interconnection density by utilizing multiple routing dimensions and pathways simultaneously.

The patent implements nested interconnection structures where pillar interconnects are embedded within the substrate, wire bonds are routed over or through cavities, and multiple interconnect layers are stacked vertically. This nesting approach allows multiple interconnection pathways to occupy overlapping spatial volumes, significantly increasing interconnection density without proportionally increasing package footprint.

The patent employs composite interconnection structures combining different materials and mechanisms: pillar interconnects provide rigid electrical pathways for fast signal transmission, while solder interconnects and underfill materials provide mechanical bonding and stress distribution. This composite approach maintains direct electrical paths for high-speed signaling while incorporating mechanically robust bonding elements for structural integrity.

The patent incorporates underfill materials and encapsulation layers that are applied beforehand or simultaneously with interconnect formation to provide mechanical cushioning and stress relief. These protective elements are integrated into the structure prior to final assembly, preventing mechanical failures while preserving the direct electrical pathways needed for fast signal transmission.