Wire Bond Clamp Engaging Lead Frame Pads
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Solution Overview
Problem
The existing wire bonding process for semiconductor devices experiences stress and distortion due to pressure applied to the outer perimeter of lead frames, leading to poor bonding and increased failure rates, exacerbated by the 'bouncing' motion of wire bonding heads.
Innovation Solution
A customizable wire bond clamp that engages directly with the semiconductor die supporting pads and inwardly-extending leads, minimizing stress and distortion by applying pressure to specific engaging features, thereby stabilizing the components during bonding and reducing the 'bouncing' motion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pressure is applied to the outer perimeter of the lead frame during wire bonding, then the wire bonding process can be completed, but stress and distortion occur in the lead frame resulting in poor wire bonding and increased failure rates
Solution Approach 1:
The clamp is divided into multiple independent clamp arms that can engage with different portions of the lead frame (outer supporting frame, die supporting pad, and inwardly-extending leads). This segmentation allows pressure to be distributed to multiple stable anchor points simultaneously, preventing the stress concentration and distortion that occurs when pressure is applied to a single location on the outer perimeter.
Solution Approach 2:
Different portions of the clamp apply pressure to different locations of the lead frame structure. The clamp arms engage with specific features (outer supporting frame, die supporting pad, inwardly-extending leads) to apply localized pressure at optimal points, ensuring that each area contributes to stabilizing the lead frame without causing distortion to other areas.
2Productivity
If the wire bonding head moves during the bonding process, then bonding can be performed across multiple points, but a bouncing motion is imparted to the lead fingers resulting in poor wire bonds and increased failures
Solution Approach 1:
The clamp applies preliminary stabilizing pressure to the lead frame structure before wire bonding begins. By engaging the clamp arms with the outer supporting frame, die supporting pad, and inwardly-extending leads beforehand, the lead frame is pre-stabilized against the bouncing motion that would otherwise occur during wire bonding head movement, preventing NSOP, NSOL, and other bonding defects.
Solution Approach 2:
The clamp is positioned and engaged with the lead frame features before the wire bonding process starts. This preliminary action establishes a stable baseline position for the lead frame, ensuring that subsequent wire bonding operations occur on a stabilized structure rather than a moving target, thereby improving bond placement accuracy.
Data Source
AI summary
Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.