Wire Bond Layout With Lower Pressing Section to Prevent Collision
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Solution Overview
Problem
The existing wire bonding structure in semiconductor packaging faces challenges with wire collision, squeezing, and bending, especially as spacing between bonding wires decreases, leading to potential short circuits and product scrap.
Innovation Solution
A semiconductor device with a specific wire bonding configuration, including a first bonding wire with a lower pressing section and a controlled height and position, to prevent collision and squeezing by other bonding wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the spacing between bonding wires is reduced to achieve miniaturization, then the device size is reduced, but wire collision and short circuit risks increase
Solution Approach 1:
The patent introduces a vertical dimension control by creating a lower pressing section that reduces the height of the first bonding wire at a specific position. This vertical adjustment allows wires to be positioned at different heights, preventing collision while maintaining small horizontal spacing for miniaturization.
Solution Approach 2:
The patent applies local quality by creating a lower pressing section at a specific position on the first bonding wire, rather than uniformly reducing the entire wire height. This localized modification reduces collision risk at critical areas while maintaining the overall wire functionality and electrical connection.
2Reliability
If the bonding wire height is reduced to avoid collision, then wire collision risk decreases, but the wire may become too fragile or fail to make proper contact
Solution Approach 1:
The patent applies local quality by creating a lower pressing section at a specific position on the first bonding wire, rather than uniformly reducing the entire wire height. This localized modification reduces collision risk at critical areas while maintaining the overall wire functionality and electrical connection.
Solution Approach 2:
The patent performs preliminary action by pre-forming the lower pressing section on the first bonding wire before subsequent wire bonding operations. This advance preparation ensures that the wire is positioned at the correct height to avoid collision with later-bonded wires, preventing mechanical strength issues during the bonding process.
3Reliability
If the lower pressing section height is controlled to be less than 400 microns, then wire collision is prevented, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies parameter changes by specifying a quantitative range for the lower pressing section height (less than 400 microns) and its positional relationship (20%-80% of the total wire length). These defined parameters provide clear manufacturing targets that balance collision prevention with achievable precision levels.
Data Source
AI summary
A semiconductor device includes: a first wire bonding area with a first bonding pad, a second wire bonding area with a second bonding pad, and a first bonding wire connecting the first bonding pad to the second bonding pad. The first bonding wire includes a lower pressing section and a first line segment connecting the lower bonding part to the first bonding pad. A distance between the lower pressing section and a plane where the second wire bonding area is located is defined as a first height, which is smaller than 400 μm, a length of an orthographic projection of the first bonding wire on the plane is defined as a first length, a length of an orthographic projection of the first line segment on the plane is defined as a second length, and the second length is 20%-80% of the first length.