Wire Bond Embedding in 3D Printed Substrates
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Solution Overview
Problem
Existing 3D printing technologies face challenges in creating stable thermal or electrical connections between conductive traces and surfaces at different levels of dielectric substrates, as well as connecting metallic pins, due to the fragility of arching wires which can be damaged or obstruct the print head during subsequent fabrication operations.
Innovation Solution
The implementation of a wire bonding configuration with an arching wire arrangement surrounded by a levee, later filled with a liquid curable polymer or thermal set polymer, which sets permanently to protect the wire bond and maintain connections between metal structures, allowing for unobstructed 3D printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect metal structures at different levels, then thermal or electrical connections are established, but the arching wire can be damaged or obstruct the print head during subsequent fabrication operations
Solution Approach 1:
The patent introduces an embedding material as an intermediary substance that fills the space around the arching wire bond. This material mediates between the wire and the print head, preventing direct contact and potential obstruction while maintaining the wire's structural integrity and electrical/thermal connection function.
Solution Approach 2:
The arching wire bond is nested within the embedding material, creating a hierarchical structure where the wire is contained and protected by the surrounding material. This nesting approach allows the wire to maintain its arching configuration for electrical/thermal connection while being shielded from external damage and obstruction risks.
2Adaptability or versatility
If arching wires are used for wire bonding, then connections between metal structures at different levels are achieved, but the wires are fragile and can be damaged during subsequent operations
Solution Approach 1:
The embedding material is applied in advance to surround and cushion the arching wire bond before subsequent fabrication operations occur. This preemptive protection prevents the fragile wire from being damaged during later handling, printing, or assembly processes while preserving its flexibility for making connections between metal structures at different levels.
3Reliability
If wire bonding is performed to connect conductive traces and surfaces, then electrical or thermal interconnections are created, but the arching wire may obstruct the print head during subsequent fabrication
Solution Approach 1:
The embedding material serves as a mediator that allows the print head to operate freely in the space above the wire bond without risking collision or obstruction. This enables continuous fabrication operations to proceed uninterrupted while maintaining reliable electrical or thermal interconnections through the wire bond.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides stable and permanent thermal or electrical connections between metal structures, enhancing the structural integrity and functionality of 3D printed components while enabling uninterrupted 3D printing operations.
Implementation Method 1
filled with a liquid curable polymer or thermal set polymer which sets permanently to protect the wire bond
Implementation Method 2
surrounded by a levee, later filled with a liquid curable polymer or thermal set polymer
Data Source
AI summary
A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.