Wire Bond EMI Cage for Optical Emission Shielding
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Solution Overview
Problem
Existing EMI shields, such as metal can EMI shields, face challenges in effectively preventing electromagnetic interference (EMI) in electronic systems due to their inability to conform closely to the shape of electronic devices, leading to increased space requirements and potential gaps in the shield that allow EMI to pass through.
Innovation Solution
The development of a wire bond electromagnetic interference (EMI) cage, which comprises a plurality of bond wires electrically coupled to an electrical ground, overlays at least a portion of the target electrical component, and defines an EMI cage opening to allow optical outputs to pass through while blocking electromagnetic emissions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If traditional metal can EMI shields are used, then EMI blocking is provided, but the shield cannot conform closely to the shape of electronic devices and requires increased space
Solution Approach 1:
The patent uses thin wire bonds (flexible elements) to create an EMI shield that can conform to the contours of electronic devices. The wire bonds are flexible enough to follow complex device geometries while maintaining electrical connectivity and EMI shielding functionality, replacing rigid metal can shields that cannot adapt to varying shapes.
Solution Approach 2:
The continuous metal can shield is segmented into multiple individual wire bonds spaced apart from each other. This segmentation allows the shield to flex and conform to device shapes while still providing effective EMI blocking through the distributed network of grounded wires that intercept electromagnetic fields.
2Reliability
If traditional metal can EMI shields are used, then EMI blocking is provided, but gaps in the shield allow EMI to pass through
Solution Approach 1:
Rather than requiring a continuous solid shield, the patent applies EMI protection locally through strategically positioned wire bonds. Each wire bond acts as a local EMI interceptor, and the combination of multiple distributed wires provides comprehensive coverage. This local quality approach maintains reliability while reducing the complexity of creating a seamless continuous shield.
Solution Approach 2:
The wire bonds serve multiple functions simultaneously: they provide electrical connectivity between components, establish electrical ground references, and act as EMI shielding elements. This multi-functionality means the same structural elements that are necessary for circuit operation also provide EMI protection, reducing the need for separate complex shielding structures.
3Volume of stationary object
If wire bond EMI cage is used, then space is minimized and conformability is improved, but it must effectively block electromagnetic emissions while allowing optical output
Solution Approach 1:
The patent transitions from two-dimensional planar shielding to three-dimensional spatial arrangement of wire bonds. The wire bonds are positioned at specific heights and orientations above the device surface, creating a volumetric shielding structure. This dimensional approach allows the thin wire bonds to block electromagnetic emissions effectively while maintaining clearance for optical outputs and conforming to device contours.
Solution Approach 2:
The wire bonds are arranged in curved or arched configurations rather than straight lines, allowing them to follow the contours of electronic devices. This curvature enables the shields to adapt to spherical or rounded device geometries, improving conformability while maintaining effective EMI blocking through the continuous curved path of the grounded wires.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wire bond EMI cage effectively blocks electromagnetic interference to and from electrical components, reducing the risk of errors and performance loss in electronic devices, while also minimizing the space required for the EMI shield, as it can conform closely to the shape of the device and eliminate gaps.
Implementation Method 1
a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions
Implementation Method 2
each bond wire of the plurality of bond wires is electrically coupled to an electrical ground
Data Source
AI summary
An example apparatus and optical emission device for preventing the transmission of electromagnetic radiation to and from targeted electrical components of an electronic device are provided. The example apparatus may include an optical emissions component electrically connected to a target electrical portion and configured to generate an optical output. The example apparatus may further include a wire bond electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire bond electromagnetic interference cage may include a plurality of bond wires, wherein each bond wire is electrically coupled to an electrical ground, and wherein the wire bond electromagnetic interference cage overlays at least a portion of the target electrical portion. In addition, the wire bond electromagnetic interference cage may further define an electromagnetic interference cage opening through which the optical output passes.