Wire Bond Failure Detection via Force and Position Analysis
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Solution Overview
Problem
Existing methods for detecting wire bonding failures, such as non-stick-on-lead (NSOL) bonding failures, are limited to conductive semiconductor dies and do not effectively address failures in non-conductive semiconductor dies.
Innovation Solution
A wire bonder equipped with a bond head, XY table, ultrasonic transducer, and piezoelectric sensor that initializes by determining normal tail length and position, then uses controlled motion and force measurement to detect NSOL bonding failures by assessing the position and force applied during the wire bonding process, enabling detection in both conductive and non-conductive semiconductor dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical potential detection method is used to detect NSOL bonding failure, then detection reliability is improved for conductive semiconductor dies, but the method becomes inapplicable to non-conductive semiconductor dies
Solution Approach 1:
The patent implements a universal detection system that can handle both conductive and non-conductive semiconductor dies. The wire bonder is equipped with multiple detection capabilities: electrical potential detection for conductive dies and optical detection (camera-based) for non-conductive dies. This multi-functional approach allows the same equipment to reliably detect NSOL bonding failures across different die types without requiring separate detection systems.
Solution Approach 2:
The patent changes the detection parameter based on the electrical conductivity of the semiconductor die. For conductive dies, electrical potential measurement is used; for non-conductive dies, optical imaging and position analysis are used instead. This parameter adaptation allows the detection system to overcome the limitation of electrical conductivity requirements while maintaining high detection reliability across different material types.
2Ease of manufacture
If conventional wire bonding process is used, then manufacturing simplicity is maintained, but detection of bonding failures is limited and less reliable
Solution Approach 1:
The patent incorporates real-time feedback mechanisms during the wire bonding process. Sensors detect parameters such as bonding force, wire position, and electrical potential during bonding operations. This feedback allows the system to identify bonding failures immediately as they occur, providing reliable detection without adding significant complexity to the manufacturing process. The feedback loop enables continuous monitoring and quality control throughout production.
Solution Approach 2:
The patent performs preliminary detection actions before the bonding process is complete. The system monitors bonding parameters in real-time and can detect potential failures during the bonding process itself, rather than requiring separate post-bonding inspection steps. This preliminary detection approach improves reliability while maintaining manufacturing efficiency by identifying issues before they result in defective products.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for reliable detection of NSOL bonding failures in both conductive and non-conductive semiconductor dies by determining the position and force applied during the wire bonding process, enhancing the robustness of the detection method and expanding its applicability.
Implementation Method 1
A wire bonder equipped with a capillary and ultrasonic transducer, capable of forming and detecting wire bonds on both conductive and non-conductive semiconductor dies, uses a combination of positional and force measurement techniques, including a piezoelectric sensor
Implementation Method 2
A wire bonder equipped with a capillary and ultrasonic transducer, capable of forming and detecting wire bonds
Data Source
AI summary
Disclosed is a method of detecting a bonding failure of a wire bonder, which comprises a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire. The method comprises the steps of: forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting whether the second wire bond remains bonded to the substrate; and determining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate.