Wire Bond Faraday Cage Structure for Low-Profile 3D Package EMI
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Solution Overview
Problem
Conventional interference shielding methods are bulky, unsuitable for mobile and low-profile applications, and ineffective for stacked die or package configurations in microelectronic assemblies, particularly in three-dimensional (3D) ICs.
Innovation Solution
The use of wire bond wires with varying heights to create a Faraday cage-like structure around microelectronic devices, where taller wires provide shielding against electromagnetic interference (EMI) and shorter wires serve as signal wires, coupled to a conductive surface that covers the shielding region to effectively manage EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional shielding methods are used, then EMI shielding effectiveness is improved, but device weight and volume increase
Solution Approach 1:
The patent uses thin wire bond wires (diameter of 25-50 micrometers) arranged in a mesh pattern to create a lightweight shielding structure. These thin filaments form a Faraday cage that blocks EMI while adding minimal weight compared to conventional solid shielding materials.
Solution Approach 2:
The wire bond wire arrangement creates a porous mesh structure with spaces between the wires. This porous configuration provides effective EMI shielding through the distributed conductive elements while maintaining low weight and allowing signal penetration where needed.
2Object-affected harmful factors
If conventional shielding methods are used, then EMI shielding effectiveness is improved, but device profile height increases
Solution Approach 1:
The wire bond wires are arranged as thin, flat layers on the circuit board surface, creating a low-profile shielding structure. The wires lie substantially in the plane of the board with minimal vertical protrusion, maintaining a sleek device profile.
Solution Approach 2:
The shielding function is achieved by distributing conductive elements in the horizontal plane (2D mesh pattern) rather than building up vertical shielding layers. This dimensional approach provides effective EMI blocking without increasing device height.
3Object-affected harmful factors
If wire bond wires are arranged to provide shielding, then EMI shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The wire bond wires serve dual functions: providing EMI shielding and enabling electrical interconnections between circuit board layers. This multi-functionality eliminates the need for separate shielding structures, simplifying the overall manufacturing process.
Solution Approach 2:
The patent combines the shielding function with the existing wire bond interconnect structure. By integrating EMI protection into the necessary electrical connection pathways, the design avoids adding separate shielding components and processes.
4Object-affected harmful factors
If wire bond wires with varying heights are used, then shielding effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The wire bond wires have different lengths positioned at different locations, with taller wires providing shielding and shorter wires serving as signal connections. This local differentiation optimizes shielding effectiveness in specific areas while maintaining manufacturing feasibility through standard wire bonding techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides effective EMI shielding in a compact and lightweight form, suitable for both 2D and 3D microelectronic packages, enhancing protection without the bulkiness of conventional methods.
Implementation Method 1
wire bond wires with varying heights to create a Faraday cage-like structure around microelectronic devices
Implementation Method 2
taller wires provide shielding against electromagnetic interference (EMI)
Implementation Method 3
A conductive surface is over the first portion of the wire bond wires for covering the shielding region
Data Source
AI summary
Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.