Wire Bond Faraday Cage Shielding for Low-Profile Microelectronic Packages
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Solution Overview
Problem
Conventional interference shielding for microelectronic assemblies is bulky, heavy, or unsuitable for low-profile and stacked die applications, and does not effectively protect against electric-magnetic interference (EMI) and radio frequency interference (RFI).
Innovation Solution
The use of wire bond wires coupled to a ground plane to form a Faraday cage for shielding, with varying heights to create a shielding region for one microelectronic device and signal wires for another, covered by a conductive surface to manage interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional interference shielding is used, then EMI and RFI protection is provided, but the shielding becomes bulky and heavy
Solution Approach 1:
The patent uses thin wire bond wires arranged in specific patterns to create interference shielding instead of traditional bulky shield structures. The wire bonds form a mesh-like barrier that blocks EMI and RFI while maintaining minimal thickness and weight, effectively replacing conventional rigid shielding materials with flexible, thin conductive elements.
Solution Approach 2:
The patent transitions from planar or volumetric shielding structures to a three-dimensional arrangement of wire bonds extending vertically from the substrate. By utilizing the vertical dimension and arranging wires at different heights, the shielding achieves effective EMI/RFI protection with minimal horizontal footprint and reduced overall volume.
2Object-affected harmful factors
If conventional interference shielding is used, then EMI and RFI protection is provided, but the shielding becomes too large for low-profile applications
Solution Approach 1:
The wire bond shielding structure uses extremely thin conductive elements arranged in space to create an effective shielding barrier. This approach achieves the required EMI and RFI protection with minimal volume, as the wire bonds occupy negligible space compared to conventional shield enclosures while maintaining protective functionality.
Solution Approach 2:
The patent employs vertical wire bond arrangements that extend upward from the substrate surface, utilizing the third dimension to create shielding volume efficiency. This vertical configuration provides effective EMI/RFI protection without increasing the horizontal footprint, enabling low-profile application integration.
3Object-affected harmful factors
If conventional interference shielding is used, then EMI and RFI protection is provided, but the shielding is too complicated to fabricate
Solution Approach 1:
The wire bonds serve dual functions: electrical interconnection between components and interference shielding. By integrating the shielding function into the existing wire bond interconnect structure, the patent eliminates the need for separate shielding fabrication processes, reducing manufacturing complexity while providing effective EMI and RFI protection.
Solution Approach 2:
The patent combines the interconnection and shielding functions into a single wire bond structure. The same wires that carry electrical signals also form the shielding barrier, merging two previously separate functions into one integrated solution, thereby simplifying the overall fabrication process.
4Object-affected harmful factors
If conventional interference shielding is used, then EMI and RFI protection is provided, but the shielding is not suitable for stacked die or 3D ICs
Solution Approach 1:
The patent uses vertical wire bond arrangements that extend in the third dimension, creating shielding structures compatible with stacked die and 3D IC architectures. This vertical configuration allows the shielding to effectively protect multiple layers and stacked components from EMI and RFI, adapting to three-dimensional integrated circuit designs.
Solution Approach 2:
The wire bond shielding can be selectively arranged around specific devices or regions that require protection, allowing customized shielding configurations for different areas of stacked die or 3D IC assemblies. This local adaptability enables effective EMI/RFI protection tailored to the specific layout and requirements of three-dimensional integrated circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides effective interference shielding that is compact and suitable for low-profile and stacked die configurations, reducing internal noise and protecting microelectronic devices from EMI and RFI.
Implementation Method 1
wire bond wires coupled to a ground plane to form a Faraday cage for shielding
Data Source
AI summary
Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.