Wire Bond Free End Formation via Plastic Deformation
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Solution Overview
Problem
Conventional etching processes struggle to form microcontacts with a high aspect ratio and arrays of microcontacts with small pitch or spacing, and wire bonding methods face challenges in consistency and accuracy regarding height and positioning.
Innovation Solution
A method involving a bonding tool to join and deform a metal wire, applying tension to create wire bonds with free ends, which are then encapsulated, allowing for the formation of microelectronic packages with precise interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching processes are used to form microcontacts, then the manufacturing process is simple, but the aspect ratio and pitch precision are insufficient
Solution Approach 1:
The patent replaces conventional chemical etching processes with a mechanical wire bonding system that uses controlled wire deposition and bonding. This substitution enables precise control of microcontact geometry, achieving high aspect ratios and small pitch values that are impossible with etching alone, while maintaining manufacturing feasibility through automated wire bonding equipment
Solution Approach 2:
The invention changes the fundamental parameters of the manufacturing process by transitioning from batch chemical etching to sequential mechanical wire bonding. This allows independent control of wire length, diameter, bonding force, and positioning, enabling precise adjustment of aspect ratio and pitch parameters to meet specific design requirements
2Adaptability or versatility
If wire bonding methods are used to form interconnects, then flexibility is improved, but consistency and positioning accuracy deteriorate
Solution Approach 1:
The patent incorporates feedback control mechanisms in the wire bonding process, where bonding parameters such as wire length, bonding force, and positioning are monitored and adjusted in real-time. This feedback system ensures consistent height and positioning accuracy across all wire bonds while maintaining the flexibility to adapt to different interconnect requirements
Solution Approach 2:
The invention performs preliminary actions by pre-positioning the wire bond structure and pre-controlling bonding parameters before actual bonding occurs. This includes pre-setting wire length, pre-aligning bonding locations, and pre-configuring bonding forces, which ensures consistent positioning and height accuracy while maintaining process flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of microelectronic packages with precise and consistent wire bonds, overcoming the limitations of conventional etching and wire bonding techniques, facilitating high-speed operations by providing efficient electrical connections.
Implementation Method 1
using the bonding tool to apply pressure to the metal wire to cause a region of the metal wire between the surface and the metal element to plastically deform
Implementation Method 2
using the bonding tool to apply tension to the metal wire to cause a first portion of the metal wire having the end joined to the conductive element to detach from a remaining portion of the metal wire at the plastically deformed region
Data Source
AI summary
A method of forming a wire bond having a free end includes joining an end of a metal wire to a conductive element at a surface of a first component, the end of the metal wire being proximate a surface of a bonding tool adjacent an aperture through which the metal wire extends. A predetermined length of the metal wire is drawn out from the aperture. The surface of the bonding tool is used to plastically deform a region of the metal wire between the surface of the bonding tool and a metal element at the surface of the first component. The bonding tool then applies tension to the metal wire to cause a first portion of the metal wire having the end joined to the conductive element to detach from a remaining portion of the metal wire at the plastically deformed region.