Wire Bond Loop Sequencing to Avoid Overlap and Interference
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Solution Overview
Problem
Existing methods for forming wire loops in wire bonding processes are laborious and time-consuming, relying heavily on manual processes and user experience, which limits productivity and efficiency.
Innovation Solution
A method is developed to automatically determine the sequence for creating a plurality of wire loops by analyzing workpiece data, including position data and wire loop data, considering overlap conditions, wire loop heights, lateral bend conditions, and wire loop positions to optimize the wire bond sequence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual processes and user experience are used to determine wire loop sequences, then expertise-based quality control is achieved, but productivity is limited and the process is laborious
Solution Approach 1:
The patent replaces manual determination of wire loop sequences with an automated computer-based system that uses algorithms to analyze workpiece data and generate optimal bonding sequences. This substitution of mechanical/manual processes with automated computational methods directly resolves the contradiction by eliminating the laborious manual process while maintaining or improving quality control through systematic analysis of overlap conditions, wire loop heights, and lateral bend conditions.
2Productivity
If automated sequence determination is implemented, then productivity is improved and manual effort is reduced, but system complexity increases
Solution Approach 1:
The patent introduces a computer as an intermediary between the workpiece data and the wire bonding process. This intermediary automatically analyzes workpiece data including bonding locations and wire loop parameters, then determines the optimal sequence without requiring complex manual calculations or expertise. The computer intermediary simplifies the overall system by centralizing the decision-making logic in a programmable device rather than requiring complex human judgment processes.
Solution Approach 2:
The automated system performs self-service by automatically analyzing its own workpiece data and generating the bonding sequence without external human intervention. The computer system independently evaluates overlap conditions, wire loop heights, and lateral bend conditions to determine the optimal sequence, eliminating the need for manual process determination while maintaining simplicity through self-contained automation.
3Manufacturing precision
If comprehensive analysis of workpiece data is performed, then sequence optimization is achieved, but analysis time and computational effort increase
Solution Approach 1:
The patent performs preliminary action by analyzing all workpiece data including overlap conditions, wire loop heights, and lateral bend conditions before the actual wire bonding process begins. The computer determines the optimal sequence in advance, allowing comprehensive analysis to be completed once before production, rather than requiring repeated analysis during the bonding process. This preliminary computation optimizes manufacturing precision while minimizing time loss during actual production.
Solution Approach 2:
The system maintains continuity of useful action by automatically processing workpiece data and generating bonding sequences without interruption. The computer continuously analyzes the workpiece characteristics and immediately outputs the optimized sequence, eliminating idle time between data analysis and process execution. This continuous automated operation ensures comprehensive analysis is performed efficiently without adding significant time to the overall manufacturing process.
Data Source
AI summary
A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b).