Wire Bond Imaging Across Multiple Focal Planes for Height Accuracy
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Solution Overview
Problem
Existing wire bonding systems struggle to consistently form wire structures with accurate height and position, lacking effective imaging methods to ensure precise formation of wire loops and other structures.
Innovation Solution
The method involves imaging wire structures using a camera to determine the camera to determine the presence or absence of wire structures by varying focal planes and adjusting parameters if necessary.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single focal plane is used for imaging wire structures, then the imaging system is simple and fast, but the height and position precision of wire structures cannot be consistently measured
Solution Approach 1:
The patent transitions from single-plane 2D imaging to multi-plane 3D imaging by varying the focal plane through the wire structure. This dimensional change enables accurate measurement of wire height and position by capturing images at multiple focal depths and processing them to determine three-dimensional characteristics of the wire structure.
Solution Approach 2:
The patent performs preliminary imaging actions by capturing multiple images at different focal planes before final analysis. This preliminary multi-plane imaging establishes the depth information needed for accurate height and position measurement, allowing the system to pre-determine wire characteristics before making bonding decisions.
2Manufacturing precision
If multiple focal planes are used to image wire structures, then height and position accuracy improves, but imaging time and processing complexity increase
Solution Approach 1:
The patent maintains continuous useful action by implementing an automated multi-plane imaging sequence where images are captured at multiple focal planes in rapid succession without manual intervention. This continuous automated process minimizes idle time between imaging steps while ensuring accurate wire structure measurement for precise bonding.
Solution Approach 2:
The patent employs feedback mechanisms by analyzing images from multiple focal planes to determine wire height and position, then using this information to adjust bonding parameters or detect wire structure anomalies. This feedback loop ensures manufacturing precision while the automated nature of the feedback process minimizes time loss.
3Reliability
If edge detection methods are used to determine wire height, then the system can detect wire position, but consistency in wire structure formation is difficult to achieve
Solution Approach 1:
The patent introduces an intermediary multi-plane imaging approach between direct edge detection and accurate height measurement. By capturing images at multiple focal planes and processing them to determine wire characteristics, the system creates an intermediary measurement method that is more reliable than single-plane edge detection while maintaining practical implementation feasibility.
Solution Approach 2:
The patent moves from two-dimensional edge detection to three-dimensional measurement by varying the focal plane through the wire structure. This dimensional transition enables consistent wire structure formation by accurately measuring height and position in three dimensions, providing more reliable data for bonding control than planar edge detection alone.
Data Source
AI summary
A method of imaging a wire structure on a wire bonding system is provided. The method includes the steps of: (a) forming the wire structure at a bonding location of a workpiece on the wire bonding system, the wire structure including a bonded portion bonded to the bonding location, and a free end continuous with the bonded portion; and (b) imaging a portion of the wire structure on the wire bonding system using a plurality of distinct focal planes.