Semiconductor Wire-Bond Open Detection Using Voltage Difference Sensing
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Solution Overview
Problem
Existing semiconductor devices fail to directly detect wire disconnections in multi-bonding configurations, as the disconnection of one wire does not immediately affect the electrical connection of others, making it difficult to diagnose open faults such as wire cuts or terminal separations.
Innovation Solution
Incorporating a detection circuit that passes a current through connection lines connected to power supply or reference potentials, amplifies the voltage difference, and outputs a detection signal to identify open states, allowing for the detection of wire disconnections by monitoring changes in potential differences caused by resistance changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-bonding is performed to connect multiple electrode pads to the same lead terminal, then the electrical connection reliability is improved, but the ability to detect wire disconnection deteriorates
Solution Approach 1:
The patent segments the detection function by providing separate detection circuits for each lead terminal. Each detection circuit independently monitors the connection status of wires connected to its corresponding terminal, enabling individual wire disconnection detection even in multi-bonding configurations where multiple wires connect to the same terminal.
Solution Approach 2:
The patent introduces detection circuits as intermediary components between the wires and lead terminals. These detection circuits act as mediators that monitor the electrical connection status and generate detection signals, enabling indirect observation of wire integrity without disrupting the primary electrical connection function.
2Difficulty of detecting and measuring
If a detection circuit is added to detect wire disconnections, then the disconnection detection capability is improved, but the device complexity increases
Solution Approach 1:
The patent merges the detection function with the existing lead terminal structure. The detection circuits are integrated into the terminal architecture, sharing common elements such as power supply connections and signal processing pathways, thereby reducing overall system complexity despite adding detection functionality.
Solution Approach 2:
The detection circuits are designed with universal functionality that can detect various types of connection failures (wire cuts, terminal separations, pad separations) using a single unified approach. This multi-functional design eliminates the need for separate detection mechanisms for different failure modes, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the reliable detection of wire disconnections and open faults, preventing functional failures by identifying changes in resistance values, thereby ensuring timely diagnosis and preventing operational issues.
Implementation Method 1
causes a predetermined current to flow through each of the connection lines connected to the two power supply potentials
Implementation Method 2
amplifies the difference between the voltages of the two connection lines
Implementation Method 3
identifying changes in resistance values
Data Source
AI summary
A semiconductor device includes a semiconductor chip having first, second and third pads, first and second external terminals to which a power supply potential or a reference potential is supplied, first and second wires connecting the first and second external terminals and the first and second pads, and a third wire connecting the second external terminal and the third pad. The semiconductor chip further includes a first internal wiring connected to the first and second pads, a second internal wiring connected to the third pad, and a detection circuit. The detection circuit includes: a current source for passing a current through the first and second internal wirings; first and second resistive elements connected between the current source and the first and second internal wirings; and an amplifier circuit for amplifying a relative potential difference generated between the first and second resistive elements and outputting a detection signal.