Wire-Bonded Semiconductor Package Cooling in Bonding-Wire Dead Space
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional cooling techniques for semiconductor devices require additional space for cooling components, leading to increased device size and potential deformation due to heat generation.
Innovation Solution
A semiconductor device configuration with a heat dissipation member disposed between the bonding wire and the wiring board, utilizing a heat pipe and thermally conductive resin to enhance heat conduction, and a frame portion that surrounds the semiconductor chip to facilitate efficient heat dissipation without enlarging the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling block or Peltier element is disposed on the back side of a semiconductor chip, then heat dissipation is improved, but the device size increases
Solution Approach 1:
The heat dissipation member is positioned in the vertical dimension between the bonding wire and the wiring board, utilizing the dead space in the Z-direction rather than expanding the horizontal footprint. This allows heat dissipation functionality to be added without increasing the device's planar dimensions.
Solution Approach 2:
The heat dissipation member is nested within the existing structural space between the bonding wire and the wiring board, effectively utilizing the dead space that already exists in the device architecture. This nesting approach allows the cooling function to be integrated without adding external volume.
2Productivity
If high functionality and processing speeds are increased in semiconductor chips, then performance is improved, but heat generation increases
Solution Approach 1:
The heat dissipation member acts as an intermediary thermal management component between the semiconductor chip (heat source) and the surrounding environment. It facilitates heat transfer from the chip through the bonding wire area to the wiring board, enabling high-performance operation without excessive heat accumulation.
Solution Approach 2:
The bonding wire area, which traditionally serves only for electrical connection, is utilized as a heat dissipation path. The dead space below the bonding wire is converted from an unused volume into an effective thermal management zone, turning a structural constraint into a cooling advantage.
3Temperature
If conventional cooling components are added to semiconductor devices, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipation member serves multiple functions: it provides thermal management by conducting heat away from the semiconductor chip, and it utilizes the existing dead space in the device structure. This multi-functionality approach adds cooling capability without proportionally increasing structural complexity.
Solution Approach 2:
The device's own structural space (the dead space below the bonding wire) is utilized for heat dissipation purposes, rather than requiring entirely separate cooling infrastructure. The existing architectural features are repurposed to provide cooling functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the size of semiconductor devices by utilizing dead spaces for cooling, improves heat conduction efficiency, and prevents deformation by distributing heat through multiple side surfaces, thereby maintaining device functionality.
Implementation Method 1
a heat dissipation member which forms at least a part of a heat dissipation path for cooling heat generated in the semiconductor chip
Implementation Method 2
the heat dissipation member can be constituted by a heat pipe
Data Source
AI summary
A semiconductor device according to the present technology includes a semiconductor chip, and a wiring board portion having the semiconductor chip mounted thereon and having an external connection terminal for establishing electrical connection to the outside, the external connection terminal being formed on its back surface which is a surface opposite to its front surface which is a surface on which the semiconductor chip is mounted, in which the semiconductor chip is connected to a terminal formed on the front surface of the wiring board portion through a bonding wire to be wire-bonded to the wiring board portion, and a heat dissipation member is disposed between the bonding wire and the wiring board portion.