Semiconductor Package Wire-Bond Mounting for Thin Module Integration
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Solution Overview
Problem
There is a demand for miniaturized, lighter, and thinner electronic components that require semiconductor modules to process large amounts of data while maintaining a reduced volume, posing challenges in efficiently mounting semiconductor packages within limited structures and performing tests without increasing module thickness or area.
Innovation Solution
The use of bonding wires instead of ball grid arrays (BGAs) for connecting semiconductor packages to module substrates, along with molding members for protection, allows for efficient mounting and testing within a limited structure, reducing overall thickness and area by eliminating the need for test pads and solder balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ball grid arrays (BGAs) and test pads are used for connecting and testing semiconductor packages, then reliable electrical connection and testing are achieved, but module thickness and area increase
Solution Approach 1:
The patent extracts and eliminates the BGA solder balls and test pads from the conventional semiconductor package structure. Instead of using BGAs for connection and dedicated test pads for testing, the invention uses bonding wires that serve both connection and testing functions, thereby removing the thickness-contributing elements while maintaining reliability
Solution Approach 2:
The bonding wire is designed to serve multiple functions: it provides electrical connection between the semiconductor chip and package substrate, and simultaneously serves as a test element for electrical testing. This multi-functionality eliminates the need for separate test pads and BGAs, reducing module thickness and area
2Reliability
If ball grid arrays (BGAs) and test pads are used for connecting and testing semiconductor packages, then reliable electrical connection and testing are achieved, but module area increases
Solution Approach 1:
The patent removes the area-occupying BGAs and test pads from the module layout. By using bonding wires for both connection and testing, the invention eliminates the need for large BGA arrays and separate test pad areas, thereby reducing the overall module area
Solution Approach 2:
The bonding wire performs dual functions of electrical connection and testing, eliminating the need for separate dedicated test pads and BGA structures. This consolidation significantly reduces the area required for these components in the module layout
3Reliability
If conventional mounting methods are used for semiconductor packages, then reliable connection is achieved, but device complexity and mounting difficulty increase in limited structures
Solution Approach 1:
The patent extracts the complex BGA solder ball array and associated underfill structures from the mounting system. By using bonding wires that can be directly connected and tested, the invention simplifies the mounting structure while maintaining connection reliability in limited space configurations
Data Source
AI summary
A semiconductor module includes a module substrate, a semiconductor package mounted on the module substrate, a first bonding wire connecting the module substrate to the semiconductor package, and a first molding member covering the first bonding wire. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, a second bonding wire connecting the package substrate to the semiconductor chip, and a second molding member covering the semiconductor chip and the second bonding wire. The first and second bonding wires are each connected to one connection pad of the package substrate.