Wire Bond Pad Layout for Stronger Imaging Sensor Connections
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Solution Overview
Problem
The existing methods for reinforcing the connection between bonding wires and electrode pads in electronic components lead to increased component size due to the need for larger electrode pads, which can cause interference with other conductive portions and affect signal noise and frequency characteristics.
Innovation Solution
The solution involves using a configuration where the second electrode pad has a specific layout with intersecting pad portions, allowing the second bonding wire to connect without extending on the first bonding wire, thereby maintaining a compact size and preventing interference with other conductive elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second bonding wire is connected to the second electrode pad at a position not on the extension of the first bonding wire to prevent capillary contact with the first bonding wire, then the connection is reinforced, but the area of the second electrode pad must be increased, which may cause interference with other conductive portions
Solution Approach 1:
The patent changes the spatial arrangement from a one-dimensional extension along the first bonding wire to a two-dimensional layout where the second electrode pad is positioned at an angle (e.g., 45 degrees) relative to the first bonding wire. This dimensional change allows the second bonding wire to be connected without extending on the first bonding wire, preventing capillary contact while maintaining compact electrode pad area
Solution Approach 2:
The patent introduces asymmetric positioning of the second electrode pad relative to the first bonding wire, where the connection point is deliberately offset from the extension line of the first bonding wire. This asymmetric arrangement ensures that the capillary does not contact the first bonding wire during the bonding process, while maintaining optimal connection strength
2Reliability
If the area of the second electrode pad is increased to secure space for connection of the second bonding wire, then the connection can be reinforced, but the electronic component size becomes larger
Solution Approach 1:
By transitioning from linear extension to angular positioning in two dimensions, the patent achieves effective connection reinforcement without requiring increased electrode pad area, thereby maintaining compact electronic component size
Solution Approach 2:
The patent changes the positional parameter of the second electrode pad from being on the extension line to being at a specific angle (e.g., 45 degrees), which optimizes the spatial utilization and allows compact design while maintaining connection strength
3Object-affected harmful factors
If the arrangement distance of the second electrode pad and other conductive portions is increased to avoid interference, then interference is prevented, but the electronic component size becomes larger
Solution Approach 1:
The asymmetric positioning of the second electrode pad at an angle to the first bonding wire naturally creates sufficient spacing from other conductive portions without requiring increased overall component dimensions, thus preventing interference while maintaining compact size
Data Source
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AI summary
An electronic component device 1 includes a first electronic component 10 on which a first electrode pad 14 is disposed, a second electronic component 20 on which a second electrode pad 24 having a first pad portion 24a and a second pad portion 24b is disposed, a first bonding wire W1 having one end connected to the first electrode pad 14 and the other end connected to the first pad portion 24a, and a second bonding wire W2 having one end connected to a connection portion C1 between the first pad portion 24a and the first bonding wire W1 and the other end connected to the second pad portion 24b. The second electrode pad 24 is disposed on the second electronic component 20 so that the first pad portion 24a and the second pad portion 24b are laid along a direction intersecting with an extending direction of the first bonding wire W1. The extending direction of the first bonding wire W1 intersects with an extending direction of the second bonding wire W2.