Electronic Package Shielding Using Bonding Wires to Save Substrate Area
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Solution Overview
Problem
Conventional semiconductor packages face challenges in integrating heat dissipation and shielding functions due to the large area occupied by heat sinks, which hinders miniaturization and increases process time, making mass production inefficient.
Innovation Solution
The solution involves replacing the conventional heat sink with conductors that are narrower and more integrated, using a carrier to form multiple packaging modules, and employing a singulation process to reduce substrate usage and process time, while maintaining heat dissipation and shielding capabilities through a conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a heat sink with supporting legs is used to provide heat dissipation and shielding functions, then the shielding effectiveness is improved, but the use area of the packaging substrate is greatly increased
Solution Approach 1:
The invention extracts the shielding function from the heat sink structure and implements it through a separate conductive layer formed on the encapsulation layer. This conductive layer is electrically connected to ground pads through conductors, creating an independent shielding system that does not require the heat sink's supporting legs to occupy substrate area.
Solution Approach 2:
The heat sink is redesigned to focus solely on heat dissipation function, while the shielding function is transferred to a dedicated conductive layer structure. This separation allows each component to be optimized for its specific function without compromising the other, reducing overall substrate area requirements.
2Object-affected harmful factors
If the semiconductor chip and heat sink are placed on a single packaging substrate, then the shielding function is achieved, but the process time is greatly increased
Solution Approach 1:
The invention segments the shielding implementation into distinct stages: first forming the encapsulation layer covering the chip, then forming conductors that extend from the encapsulation layer to ground pads, and finally forming a conductive layer on the encapsulation layer. This segmented approach allows parallel processing and reduces overall process time compared to placing both chip and heat sink on the substrate simultaneously.
Solution Approach 2:
The encapsulation layer is formed first to cover and protect the semiconductor chip before the conductive shielding layer is added. This preliminary encapsulation allows subsequent shielding structures to be formed without requiring the chip and heat sink to be pre-positioned on the substrate, enabling more efficient mass production processes.
3Temperature
If supporting legs of the heat sink are disposed on the packaging substrate, then the heat dissipation function is provided, but the use area of the packaging substrate is occupied
Solution Approach 1:
The invention moves the heat dissipation function from a two-dimensional substrate-based support structure to a three-dimensional configuration where the heat sink is positioned above the substrate and thermally coupled to the chip through vertical thermal pathways. This dimensional transition eliminates the need for supporting legs to occupy substrate area while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the substrate area required, enables miniaturization, and significantly shortens the production process by using conductors for both heat dissipation and shielding, allowing for more compact electronic designs and efficient mass production.
Implementation Method 1
the encapsulation layer is bonded onto the substrate structure by the first surface of the encapsulation layer
Implementation Method 2
a conductive layer formed on the encapsulation layer and in contact with the conductors
Data Source
AI summary
An electronic package is provided, in which an electronic component and conductors are disposed on a substrate structure, and the electronic component and the conductors are covered by an encapsulation layer. A conductive layer is formed on side surfaces of the encapsulation layer and in contact with the conductors, where the conductors are bonding wires used in a wire bonding process. Therefore, a conventional heat sink is replaced by the conductors, thereby reducing a use area of the substrate structure.