Wire Bond Stiffening Layer for High Aspect Ratio Microcontacts
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Solution Overview
Problem
Conventional etching processes are limited in forming microcontacts with high aspect ratios and arrays of microcontacts with small pitch or spacing, making it difficult to create efficient interconnects for microelectronic packages.
Innovation Solution
A microelectronic package is formed with wire bonds that have tapered ends and are encapsulated with a stiffening layer, allowing for increased structural integrity and flexibility in interconnect configurations, including angled projections and varied pitch arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching processes are used to form microcontacts, then manufacturing simplicity is maintained, but manufacturing precision deteriorates for high aspect ratios and small pitch arrangements
Solution Approach 1:
The patent replaces conventional chemical etching processes with a mechanical wire bonding process to form microcontacts. Wire bonds are used to create conductive interconnects with high aspect ratios and small pitch arrangements, achieving manufacturing precision that etching cannot provide while maintaining ease of manufacture through established wire bonding technology
Solution Approach 2:
The patent changes the fundamental approach from chemical material removal (etching) to physical wire placement and bonding. This parameter change enables precise control over microcontact geometry, aspect ratio, and pitch, allowing formation of complex interconnect structures that were previously unachievable with etching processes
2Adaptability or versatility
If wire bonds are used for interconnects, then interconnect flexibility and density are improved, but structural integrity deteriorates without additional support
Solution Approach 1:
The patent creates a composite structure by combining wire bonds with dielectric encapsulation material. The wire bonds provide flexible conductive interconnects while the dielectric material provides mechanical support and structural integrity, creating a composite assembly that achieves both flexibility and strength
Solution Approach 2:
The patent segments the interconnect structure into distinct functional components: wire bonds for electrical connection and flexibility, and dielectric encapsulation for structural support. This segmentation allows each component to optimize its specific function while working together as an integrated system
3Volume of moving object
If microelectronic packages are made compact, then assembly density is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent uses thin dielectric encapsulation layers to provide structural support and thermal management in a compact form factor. The thin film structure minimizes package volume while maintaining adequate heat dissipation pathways, allowing compact assembly without sacrificing thermal performance
Data Source
AI summary
Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.