Semiconductor Wire Bond Layout to Suppress Sweep and Peeling
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Solution Overview
Problem
Existing semiconductor devices face challenges in preventing wire sweep and peeling issues during the manufacturing process, which can lead to electrical connection failures and reduced reliability.
Innovation Solution
The semiconductor device incorporates a die pad with recessed openings and inclined wire bonding, along with dummy leads, to prevent wire sweep and peeling, ensuring stable electrical connections and improved mounting reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonding is used in semiconductor device manufacturing, then electrical connections can be established, but wire sweep and peeling issues occur during the manufacturing process leading to connection failures
Solution Approach 1:
The patent applies preliminary anti-action by designing the die pad with recessed openings and positioning structures before wire bonding occurs. These pre-configured structural features create physical constraints that prevent wire sweep and peeling during subsequent manufacturing processes, addressing the harmful effects before they can manifest.
Solution Approach 2:
The die pad is segmented with multiple recessed openings that divide and constrain wire paths. This segmentation creates individual containment zones for each wire bonding location, preventing wires from sweeping across adjacent areas and reducing the risk of peeling by anchoring wires within specific recessed regions.
2Ease of manufacture
If wire bonding is performed without structural constraints, then manufacturing process is simple, but wire sweep occurs leading to manufacturing defects
Solution Approach 1:
The recessed openings are pre-formed in the die pad before wire bonding operations. This preliminary action establishes predetermined wire paths and bonding locations, guiding the wire bonding process without requiring complex real-time positioning control, thus maintaining manufacturing simplicity while improving precision.
Solution Approach 2:
The recessed openings act as intermediary structures between the wire bonding equipment and the final electrical connection. These intermediate features provide physical guidance and constraint for wire placement, mediating between the bonding process and the required positioning accuracy without complicating the overall manufacturing flow.
3Reliability
If dummy leads are added to prevent wire sweep, then connection reliability improves, but device complexity increases
Solution Approach 1:
The die pad structure serves multiple functions: it provides electrical connection, mechanical support, and wire constraint through its recessed openings. By integrating these functions into a single component, the patent avoids adding separate dummy leads while still achieving wire sweep prevention, thus improving reliability without proportionally increasing device complexity.
Solution Approach 2:
The patent merges the wire constraint function with the existing die pad structure by forming recessed openings directly in it. This consolidation eliminates the need for separate constraint mechanisms or dummy leads, combining structural support and wire guidance into one integrated component, thereby improving reliability with minimal increase in overall device complexity.
Data Source
AI summary
A semiconductor device includes: a first lead having a die pad; a second lead arranged to be spaced apart from the first lead; a first semiconductor element mounted on the die pad; and a plurality of wires electrically connected to the first semiconductor element and the second lead, wherein the die pad and the second lead are arranged side by side in a first direction perpendicular to a thickness direction, and wherein all of the plurality of wires are inclined with respect to the first direction when viewed in the thickness direction.