Wire Bond Tips Bent Over for Anchoring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing microelectronic device interconnects lack reliability due to inadequate anchoring of wire bond wire tips, which can lead to unstable electrical connections between chips and circuit platforms.
Innovation Solution
A method and apparatus where wire bond wire tips are bent over to form anchors by pressing them against a mold film or molding layer, enhancing their anchoring capability within a microelectronic device, either before or after the formation of a molding layer, to improve interconnect reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bond wire tips are left straight, then the manufacturing process is simple, but the anchoring reliability is insufficient
Solution Approach 1:
The wire bond wire tips are pre-formed into bent configurations before the molding process. The molding compound is then injected to encapsulate the already-bent tips, locking them in place. This preliminary formation of the anchor shape eliminates the need for post-molding bending operations while ensuring reliable anchoring.
Solution Approach 2:
The patent replaces mechanical bending operations with a molding process where the bent wire tips are encapsulated in place. The molding compound flows around and secures the pre-bent tips, substituting complex mechanical anchoring mechanisms with a simpler encapsulation approach.
2Reliability
If wire bond wire tips are bent over to form anchors, then the interconnect reliability is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent combines the wire bonding operation with the molding operation into a single integrated process flow. The wire tips are bent and formed as part of the same manufacturing sequence as the molding compound injection, eliminating separate post-processing steps and simplifying overall manufacturing.
Solution Approach 2:
The anchor formation is performed preliminarily before or during the molding process rather than as a separate subsequent operation. This preliminary action integrates the complexity into an existing process step rather than adding a new manufacturing stage.
3Reliability
If wire bond wire tips are pressed against mold film, then the tips are securely anchored, but the molding material injection becomes more complex
Solution Approach 1:
The mold film serves as an intermediary element between the wire tips and the molding compound. The tips are pressed against the mold film to create anchor points, and the molding compound then flows around these anchored tips. The mold film mediates the interaction, allowing secure anchoring without direct complexity in the molding injection process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bent over tips provide enhanced anchoring, thereby increasing the reliability and stability of electrical connections between microelectronic components, reducing the likelihood of interconnect failures and improving overall device performance.
Implementation Method 1
The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over
Data Source
AI summary
In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.