Wire Bond Tunable Antenna Layout for Compact Millimeter-Wave Packages
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Solution Overview
Problem
The integration of millimeter wave antennas in mobile devices is challenging due to limited space and potential interference with adjacent circuitry, making it difficult to incorporate them into compact wireless devices.
Innovation Solution
The use of wire bonds on semiconductor devices to form tunable antennas, allowing for adjustable antenna configurations by varying the length, diameter, and material of the wire bonds, as well as connecting to multiple antenna structures, to optimize antenna performance based on communication requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If millimeter wave antennas are deposited on a PCB within a mobile device, then wireless communication capability is provided, but the device size increases and mobility decreases
Solution Approach 1:
The patent combines the antenna structure with the semiconductor device package itself, using the package substrate and wire bonds to form the antenna. This integration eliminates the need for separate antenna components on the PCB, thereby reducing overall device volume while maintaining wireless communication capability.
Solution Approach 2:
The antenna structure is nested within the existing semiconductor device package architecture. The wire bonds that are already present for electrical connectivity are utilized to form the antenna elements, effectively nesting the communication function within the structural framework of the device package.
2Adaptability or versatility
If millimeter wave antennas are deposited on a PCB, then wireless communication is enabled, but interference with adjacent circuitry occurs
Solution Approach 1:
The antenna function is extracted from the PCB plane and relocated to the vertical dimension within the device package. By using wire bonds extending upward from the package substrate to form antenna elements, the radiation sources are positioned away from adjacent circuitry on the PCB, reducing electromagnetic interference.
Solution Approach 2:
The patent transitions the antenna structure from a two-dimensional PCB surface to a three-dimensional configuration using vertical wire bonds. This dimensional change positions the antenna elements in the Z-direction above the PCB, spatially separating them from adjacent circuitry and minimizing interference.
3Adaptability or versatility
If wire bonds are used to form tunable antennas, then antenna configuration can be optimized for different communication requirements, but device complexity increases
Solution Approach 1:
The wire bonds serve dual functions: providing electrical connectivity between the semiconductor die and external circuits, and simultaneously forming the antenna radiating elements. This multi-functionality eliminates the need for separate antenna components, reducing overall device complexity while maintaining configuration flexibility.
Solution Approach 2:
The antenna configuration is made tunable by selectively connecting different wire bond lengths or configurations to the radio frequency circuitry. This dynamic reconfigurability allows optimization for different communication frequencies and requirements without requiring multiple fixed antenna structures.
Data Source
AI summary
A semiconductor device, or semiconductor device package, that includes a substrate having an antenna structure on a surface of the substrate and a wire bond that electrically connects the antenna structure to the substrate to form an antenna or a first antenna configuration. The substrate may include a second antenna structure with the wire bond connected to the second antenna structure forming a second antenna or antenna configuration. The semiconductor device may include a radio communication device electrically connected to the substrate. The antenna or antenna configuration may be tuned to the requirements of the radio communication device. The antenna configuration may be tuned by connected to different antenna structures on the surface of the substrate. The antenna configuration may be tuned by changing a length of the wire bond, changing a diameter of the wire bond, and/or changing the material of the wire bond.