Wire Bond Vias for High-Density Microelectronic Interconnects
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Solution Overview
Problem
Conventional etching processes are limited in forming microcontacts with a high aspect ratio and arrays of microcontacts with small pitch or spacing, making it difficult to create efficient microelectronic packages with high-density interconnections.
Innovation Solution
A method of forming wire bonds by positioning a bonding tool and wire portion relative to each other to extend the wire beyond the tool face, severing it, and bonding it to a substrate, allowing for precise control of wire bond length and pitch, enabling the creation of microelectronic packages with improved interconnect density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching processes are used to form microcontacts, then the manufacturing process is simple, but the aspect ratio and pitch of microcontacts are limited
Solution Approach 1:
The patent replaces conventional chemical etching processes with a mechanical wire bonding process. Wire bonds are formed by positioning a bonding tool and wire portion relative to each other, extending the wire beyond the tool face, severing it, and bonding it to a substrate. This mechanical approach enables precise control of wire bond length and pitch, achieving high aspect ratios and small pitch values that cannot be obtained through etching, while maintaining manufacturing feasibility through automated wire bonding equipment.
2Manufacturing precision
If wire bonds are used instead of etched microcontacts, then interconnect density and tolerance are improved, but the bonding process becomes more complex
Solution Approach 1:
The patent changes the key parameters of the interconnection process by transitioning from etching to wire bonding. This enables precise control of wire bond length, pitch, and positioning through mechanical means. The bonding tool can be positioned with high precision relative to the substrate, and wire bonds can be formed with controlled dimensions and spacing, achieving superior interconnect density and tolerance compared to etched microcontacts.
Solution Approach 2:
The patent performs preliminary positioning of the bonding tool and wire portion relative to each other before the actual bonding operation. The wire is extended beyond the tool face to a predetermined position, and the bonding tool is positioned at a specific height above the substrate plane. This preliminary setup enables precise control of wire bond geometry and facilitates the formation of high-density interconnect arrays with consistent dimensions.
3Manufacturing precision
If microcontacts with small pitch are formed, then interconnect density increases, but signal propagation time increases
Solution Approach 1:
The patent transitions from planar etched microcontacts to three-dimensional wire bonds that extend vertically from the substrate surface. This dimensional change allows interconnects to be formed with small pitch spacing while maintaining short effective signal paths. The wire bonds can be positioned precisely in both lateral and vertical dimensions, enabling high-density interconnect arrays with minimized signal propagation distances, thus reducing signal propagation time despite increased interconnect density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the formation of microelectronic packages with increased interconnect density and tolerance, facilitating high-speed operations by reducing signal propagation time and enabling compact, high-speed electronic assemblies.
Implementation Method 1
bonding it to a substrate, allowing for precise control of wire bond length and pitch
Data Source
AI summary
Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.