Wire Bond Wall for Doherty Amplifier Coupling
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Solution Overview
Problem
Current Doherty power amplifier semiconductor packages face challenges in miniaturization due to coupling between adjacent wire bond arrays, which affects the performance and efficiency of the power amplifier, and existing solutions to mitigate this issue, such as maintaining spatial distance between amplifiers, limit the potential for low-cost, low-weight, and small-volume packaging.
Innovation Solution
Incorporating a wire bond wall structure within the package to provide electrical isolation between the carrier and peaking amplifiers, constructed from a mesh of wire bonds that can be grounded or connected to integrated passive devices, effectively reducing inductive coupling and acting as a shield to prevent electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If spatial distance is maintained between amplifiers to reduce coupling, then electromagnetic interference is reduced, but package volume increases
Solution Approach 1:
A wire bond wall structure is introduced as an intermediary element between the carrier amplifier and peaking amplifier. This wall comprises multiple wire bonds arranged in a grid pattern that acts as a shield to block electromagnetic coupling between adjacent amplifiers, allowing them to be placed closer together without direct spatial separation
Solution Approach 2:
The wire bond wall provides localized electromagnetic shielding specifically at the interface between amplifiers where coupling occurs most strongly. The grid pattern of wire bonds creates local shielding zones that reduce coupling in critical areas while maintaining overall package compactness
2Adaptability or versatility
If discrete devices are used for carrier and peaking amplifiers, then design flexibility is improved, but crosstalk between amplifiers increases
Solution Approach 1:
The wire bond wall serves as a mediating structure between discrete amplifier devices, blocking the propagation of electromagnetic signals that would otherwise cause crosstalk while allowing each amplifier to maintain its independent discrete device characteristics and design flexibility
3Volume of moving object
If amplifiers are placed close together for miniaturization, then package size is reduced, but inductive coupling between wire bond arrays increases
Solution Approach 1:
The wire bond wall acts as a shielding intermediary that blocks inductive coupling between wire bond arrays of adjacent amplifiers, enabling close placement for miniaturization while preventing energy loss through magnetic field coupling
Solution Approach 2:
The wire bond wall employs a grid pattern with spaced wire bonds that creates a porous structure. This porous configuration provides effective electromagnetic shielding through the distributed wire bond network while allowing the structure to be integrated into compact package designs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wire bond wall structure significantly reduces inductive coupling between the amplifiers, enabling more efficient operation of the Doherty power amplifier, allowing for a single-package implementation with improved efficiency and enabling miniaturization while maintaining low-cost, low-weight, and small-volume attributes.
Implementation Method 1
Inductive or magnetic coupling occurs when a varying magnetic field exists between current carrying parallel conductors that are in close proximity to one another, thus inducing a voltage across the receiving conductor.
Implementation Method 2
a wire bond wall including a plurality of wire bonds over the substrate between the first circuit and the second circuit, wherein the wire bond wall reduces an electromagnetic coupling between the first circuit and the second circuit
Data Source
AI summary
A system and method for a package including a wire bond wall to reduce coupling is presented. The package includes a substrate, and a first circuit on the substrate. The first circuit includes a first electrical device, a second electrical device, and a first wire bond array interconnecting the first electrical device and the second electrical device. The package includes a second circuit on the substrate adjacent to the first circuit, the second circuit includes a second wire bond array interconnecting a third electrical device and a fourth electrical device. The package includes a wire bond wall including a plurality of wire bonds over the substrate between the first circuit and the second circuit. The wire bond wall is configured to reduce an electromagnetic coupling between the first circuit and the second circuit during an operation of at least one of the first circuit and the second circuit.