Wire Bond Wall for Doherty Amplifier Crosstalk Reduction
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Solution Overview
Problem
Current Doherty power amplifier semiconductor package designs face challenges in miniaturization due to crosstalk between adjacent wire bond arrays, which limits power capability and complicates semiconductor package design, especially in wireless communication systems where high efficiency and low cost are crucial.
Innovation Solution
Incorporating a wire bond wall structure within the package to provide electrical isolation between the carrier and peaking amplifiers, constructed from a mesh of grounded wire bonds that absorb and block electromagnetic fields, thereby reducing inductive coupling and allowing for a dual-path semiconductor package with improved efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If discrete devices are placed close together in the package, then miniaturization is achieved, but crosstalk between wire bond arrays increases
Solution Approach 1:
A ground wall is introduced as an intermediary structure between the carrier amplifier and peaking amplifier wire bond arrays. This ground wall acts as a mediator that blocks electromagnetic coupling between the two arrays, allowing them to be placed closer together without increasing crosstalk. The ground wall is formed by extending the ground plane between the amplifiers and is connected to the package ground, creating an electromagnetic shield that reduces inductive and capacitive coupling.
2Object-affected harmful factors
If distance between carrier amplifier and peaking amplifier is increased, then crosstalk is reduced, but package size increases
Solution Approach 1:
The ground wall serves as an electromagnetic shield that allows the amplifiers to be placed closer together while maintaining low crosstalk levels. Without the ground wall, increasing the distance between amplifiers would be necessary to reduce crosstalk, but the ground wall enables compact placement by actively blocking the electromagnetic coupling path between the wire bond arrays.
3Productivity
If wire bond arrays are placed in close proximity, then device integration is improved, but inductive coupling increases
Solution Approach 1:
The ground wall is positioned between the wire bond arrays of the carrier and peaking amplifiers to block inductive coupling. By extending the ground plane to form this wall, the patent creates an electromagnetic barrier that prevents magnetic field coupling between the adjacent wire bonds, enabling high integration without energy loss due to inductive coupling.
4Weight of moving object
If amplifier distance is reduced for miniaturization, then package weight decreases, but coupling between amplifiers increases
Solution Approach 1:
The ground wall acts as an electromagnetic shield that allows the amplifiers to be placed closer together, reducing package weight, while simultaneously blocking the coupling between the amplifiers. The ground wall is formed by extending the ground plane between the amplifiers and connecting it to the package ground, creating a barrier that prevents electromagnetic interference despite the reduced distance between devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wire bond wall effectively reduces coupling between adjacent amplifiers, enhancing the power capability and efficiency of the Doherty power amplifier semiconductor package, enabling miniaturization while maintaining low cost and low weight, as demonstrated by simulation results showing significant reduction in coupling levels.
Implementation Method 1
a wire bond wall structure within the package to provide electrical isolation between the carrier and peaking amplifiers, constructed from a mesh of grounded wire bonds that absorb and block electromagnetic fields
Implementation Method 2
constructed from a mesh of grounded wire bonds that absorb and block electromagnetic fields
Data Source
AI summary
A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.