Wire-Bonded EMF Shielding Cage for Dense Semiconductor Packages
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Solution Overview
Problem
Semiconductor packages are increasingly exposed to electromagnetic fields (EMFs) due to their shrinking size and closer placement, leading to malfunctions and data errors, necessitating effective EMF shielding protection.
Innovation Solution
The implementation of semiconductor packages with embedded EMF shielding protection using wire bonding, where wire bonds are broken to create shield wires connected to a ground plane, surrounding the die to ground external EMF signals, while signal wires connect to signal pads for data transfer through solder balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor packages are shrunk and placed closer together to increase integration density, then productivity and device miniaturization are improved, but electromagnetic field exposure increases causing malfunctions and data errors
Solution Approach 1:
The patent segments the wire bonds into two distinct functional components: signal wires that connect the die to external contacts, and shield wires that form an electromagnetic shielding cage around the die. This segmentation allows the shielding function to be integrated without adding separate shielding structures, thereby maintaining high integration density while protecting against electromagnetic fields.
Solution Approach 2:
The wire bonds perform multiple functions: they serve as both signal transmission pathways and electromagnetic shielding elements. By making the wire bonds multi-functional, the patent eliminates the need for additional dedicated shielding structures, allowing closer package placement while maintaining electromagnetic protection.
2Object-affected harmful factors
If wire bonds are broken to create shield wires for EMF shielding, then electromagnetic protection is improved, but manufacturing complexity increases
Solution Approach 1:
The wire bonds are pre-configured in specific patterns during the wire bonding process, with certain bonds designated to become shield wires and others as signal wires. This preliminary configuration simplifies subsequent manufacturing steps, as the shielding structure is already in place before molding and breaking operations.
Solution Approach 2:
The patent extracts the shielding function from the signal transmission function by separating wire bonds into distinct shield wires and signal wires. This extraction is achieved through controlled breaking of wire bonds at specific locations, creating a simplified manufacturing process where shielding and signaling are implemented through a single wire bond structure rather than requiring separate components.
3Object-affected harmful factors
If wire bonds are used to create shielding cage around die, then EMF protection is improved, but device complexity increases
Solution Approach 1:
The wire bonds serve dual purposes as both electrical connection pathways and electromagnetic shielding elements. This multi-functionality reduces structural complexity by eliminating the need for separate shielding structures, maintaining a compact design while providing comprehensive EMF protection around the die.
Solution Approach 2:
The wire bonds form a flexible, thin-wire shielding cage around the die, creating an effective electromagnetic shield without adding bulky structural elements. This thin-film approach to shielding maintains device compactness while providing robust EMF protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes EMF exposure, enhancing the performance and lifespan of semiconductor devices by creating a shielding cage around the die and ensuring reliable signal transfer.
Implementation Method 1
creating a shielding cage around the die and ensuring reliable signal transfer
Data Source
AI summary
A semiconductor package with embedded electromagnetic field (EMF) shielding protection using wire bonding is provided. The semiconductor may comprise a plurality of shield wires and signal wires. The shield wires may surround all of a portion of a die to shield the die from EMF. The shield wires and the signal wires may be formed from portions of wire bonds. In manufacturing the semiconductor package these wire bonds may be created connecting to the base and/or the die. The wire bonds may then be broken to form the shield wires and signal wires. These wires may be connected to a ground plane and/or signals pads, which are separated by a dielectric material.