Wire-Bonded IC Package Layout for Low-Parasitic Interconnects
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Solution Overview
Problem
There is a need for improved electrical performance and reduced size in packages comprising substrates and integrated devices, with existing technologies facing challenges in optimizing interconnects and parasitic introductions.
Innovation Solution
The use of wire bonds or flexible cables to couple integrated devices, which reduces the number of interconnects on the substrate, simplifies routing, and moves electrical paths outside the substrate, thereby reducing package impedance and parasitic effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional substrate-based interconnects are used to couple integrated devices, then electrical connections are established, but package impedance and parasitic effects increase, degrading electrical performance
Solution Approach 1:
The patent extracts the electrical interconnect function from the substrate by introducing wire bonds that directly couple integrated devices together, bypassing the substrate's trace-based interconnect system. This extraction eliminates the substrate traces from the high-frequency signal path, thereby removing the source of parasitic effects and package impedance that degrade electrical performance.
Solution Approach 2:
The patent introduces wire bonds as an intermediary element between integrated devices, replacing the substrate's trace-based interconnect system. These wire bonds serve as dedicated, low-parasitic pathways for electrical signals, mediating the connection between devices while minimizing interference and impedance effects that would otherwise be introduced by substrate traces.
2Ease of operation
If multiple interconnects are placed on the substrate to couple integrated devices, then electrical connections are established, but the substrate routing becomes complex and package size increases
Solution Approach 1:
The patent extracts the interconnect routing function from the substrate by using wire bonds to directly connect integrated devices. This eliminates the need for complex substrate trace routing, as the wire bonds provide direct, three-dimensional pathways between devices, thereby simplifying the substrate design and reducing overall package complexity.
Solution Approach 2:
The patent transitions from two-dimensional substrate-based routing to three-dimensional wire bond routing. By lifting the interconnect pathway into the vertical dimension, wire bonds can directly connect devices without requiring complex lateral routing on the substrate plane, thereby simplifying the routing architecture and reducing package footprint.
3Volume of moving object
If integrated devices are densely packed on the substrate, then package size is reduced, but interconnect interference and parasitic effects increase
Solution Approach 1:
The patent uses wire bonds to create three-dimensional interconnect pathways that rise above the substrate plane, allowing integrated devices to be densely packed on the substrate without increasing interconnect interference. The vertical routing dimension separates signal paths from device proximity effects, enabling high-density packaging while maintaining low interference levels.
Solution Approach 2:
The patent extracts high-frequency signal paths from the substrate plane by using wire bonds for interdevice connections. This extraction removes the signals from the congested two-dimensional substrate routing environment, thereby eliminating interconnect interference even when devices are densely packed, while still achieving compact package dimensions.
Data Source
AI summary
A package comprising a substrate; a first integrated device coupled to the substrate; a second integrated device coupled to the substrate; and a plurality of wire bonds coupled to the first integrated device and the second integrated device.