Wire-Bonded Interposer Connections for Fine-Pitch IC Packaging
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Solution Overview
Problem
There is a challenge in configuring interposer connection structures for IC packages to achieve a reduced pitch for smaller size and increased height to accommodate thicker IC components, while also considering manufacturing cost.
Innovation Solution
The integration of interposer connection structures formed through a wire bonding process, featuring a bond ball portion connected to the base structure and a bond wire portion extending towards the interposer structure, with a width ratio that allows for a tighter pitch and greater height-to-pitch ratio compared to other solutions like copper core balls or plated copper pillars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the pitch of interposer connection structures is reduced to decrease horizontal package size, then the horizontal size is reduced, but the height of connection structures must be increased to accommodate thicker IC components
Solution Approach 1:
The patent transitions from planar two-dimensional connection structures to three-dimensional vertical structures by forming bond wire pillars with height significantly greater than their pitch, enabling the connection structures to extend in the vertical dimension to accommodate thicker IC components while maintaining reduced horizontal pitch
Solution Approach 2:
The patent changes the geometric parameters of the connection structures by forming bond wire pillars where the height-to-pitch ratio is greater than 0.5, and in some embodiments greater than 1.0, representing a significant parameter change from conventional flat connections to enable both reduced pitch and increased height
2Manufacturing precision
If conventional copper core balls or plated copper pillars are used for interposer connections, then manufacturing is straightforward, but the pitch cannot be sufficiently reduced and height-to-pitch ratio is limited
Solution Approach 1:
The patent replaces conventional mechanical copper core ball or plated copper pillar formation processes with a wire bonding process that forms bond wire pillars, enabling reduced pitch and increased height-to-pitch ratio while maintaining manufacturing feasibility through established wire bonding technology
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the reduction of the horizontal size of the IC package, increases the count of interposer connection structures per unit area, and accommodates thicker IC components, while maintaining a lower manufacturing cost compared to alternative implementations.
Implementation Method 1
a bond wire portion that is coupled to the bond ball portion and extends toward the interposer structure
Data Source
AI summary
In an aspect, an integrated circuit (IC) package includes a base structure, an IC component disposed on the base structure, a plurality of interposer connection structures disposed on the base structure, and an interposer structure disposed over the IC component and the plurality of interposer connection structures. The plurality of interposer connection structures is configured to connect the base structure and the interposer structure. Each interposer connection structure of the plurality of interposer connection structures includes a bond ball portion that is connected to the base structure, and a bond wire portion that is coupled to the bond ball portion and extends toward the interposer structure. A width of the bond ball portion is greater than a width of the bond wire portion.