Moveable Arm Assembly for Wire Bonder Mode Switching

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Solution Overview

Problem

Manual wire bonding machines often require two distinct machines for ball bonding and wedge bonding, leading to complications such as component removal or unnecessary space usage when trying to perform both functions with a single machine.

Innovation Solution

A manual wire bonding machine equipped with a moveable arm assembly that rotates between ball bonding and wedge bonding positions, allowing for quick changeover by positioning specific components for each mode, including an electronic flame-off device for ball bonding and a wire spool holder for wedge bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If components are removed or interchanged when using the machine in one mode versus the other, then the machine can perform specialized functions, but the complexity of operation increases and time is lost during mode switching

Engineering Contradiction:
Improvemachine adaptabilityVSAvoidoperation simplicity
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The patent implements a movable arm assembly that can dynamically reposition between ball bonding and wedge bonding positions. The arm assembly carries different components (electrode for ball bonding, wire spool holder for wedge bonding) and moves them into appropriate positions based on the desired bonding mode, eliminating the need for manual component removal or interchange while maintaining full functionality for both bonding types

Inventive Principle:
Principle #15Dynamics

2Productivity

If components used for both modes are installed on the machine at all times, then the machine is ready for both operations, but valuable real estate is used and components may be in the way of the operator

Engineering Contradiction:
Improveoperational readinessVSAvoidmachine space utilization
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent uses a movable arm assembly that positions components only when needed. The arm can be moved to bring the electrode or wire spool holder into the working position for ball or wedge bonding respectively, keeping components compact and out of the operator's way when not in use, while maintaining immediate readiness for both bonding modes

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent utilizes vertical space by positioning the movable arm assembly overhead, allowing components to be stored in three-dimensional space above the work area rather than occupying horizontal workspace. This dimensional reorganization allows both ball bonding and wedge bonding components to coexist without interfering with the operator's access to the work area

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If two distinct machines are used for ball bonding and wedge bonding, then each machine can be optimized for its specific function, but the cost and space requirements double

Engineering Contradiction:
Improvefunctional specializationVSAvoidsystem configuration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent creates a universal wire bonding machine that can perform both ball bonding and wedge bonding functions through a single integrated system. The movable arm assembly carries both the electrode and wire spool holder, allowing the machine to switch between bonding modes without requiring separate specialized machines, thereby reducing overall system complexity while maintaining functional capabilities

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS7641097B2Moveable arm assembly for a wire bonder
Publication Date: 2010.01.05 KULICKE & SOFFA IND INC
  • US7641097B2 patent drawing
  • US7641097B2 patent drawing
  • US7641097B2 patent drawing

AI summary

A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a wedge bonding position. When the moveable arm assembly is in the ball bonding position the at least one component for the ball bonding operation is in a predetermined position for use in the ball bonding operation.