Wire Bonding Across Angled Surfaces in a Single Wire Step
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Solution Overview
Problem
Conventional wire bonding methods require two bonding wires and an additional wiring circuit to connect two different surfaces, increasing production time and cost.
Innovation Solution
A wire bonding method and apparatus that uses a single wire bonding step to connect two different surfaces by moving a capillary in multiple directions while feeding the wire and rotating the bonding stage to achieve an angle of 200° or more between the surfaces, allowing the wire to be bonded from one end to the first surface and the other end to the second surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two bonding wires are used to connect two different surfaces, then the electrical connection is achieved, but the production tact time increases and the process complexity increases
Solution Approach 1:
The patent merges two separate bonding operations into a single bonding step by using one bonding wire to connect both bonding surfaces simultaneously. The wire bonding apparatus performs both connections in one operation, eliminating the need for sequential bonding and reducing production time while maintaining reliable electrical connection between the two surfaces.
Solution Approach 2:
The bonding wire serves multiple functions by connecting to both bonding surfaces in a single operation. The wire acts as both the first bonding wire and the second bonding wire simultaneously, making the bonding process more efficient and reducing the number of steps required to achieve the desired electrical connection.
2Reliability
If two bonding wires are used to connect two different surfaces, then the electrical connection is achieved, but the device complexity and production cost increase
Solution Approach 1:
The patent combines multiple bonding operations into a single integrated process. By using one bonding wire to establish connections with both bonding surfaces in one step, the method eliminates the need for separate bonding procedures, reducing process complexity and the number of components required while ensuring reliable electrical connection.
3Ease of operation
If the capillary moves in multiple directions while feeding the wire, then the wire can reach the second bonding surface, but the wire loop becomes more bulging
Solution Approach 1:
The patent employs dynamic control of the capillary movement, allowing the capillary to move in multiple directions (X, Y, and Z directions) while feeding the wire to reach the second bonding surface. This dynamic positioning enables the wire to form an optimized loop shape that balances reachability with minimal bulging, improving both operational ease and wire geometry.
Data Source
AI summary
A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200° or more.