Wire Bonding Inspection Using Optical Area and Symmetry Analysis
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Solution Overview
Problem
Conventional methods for inspecting wire bonding in battery systems are destructive, making it difficult to accurately detect defects such as underbonding, which can lead to failure of the entire battery system.
Innovation Solution
A non-destructive wire bonding inspection method that involves photographing the bonding portion, calculating its area, and comparing it to normal data using relative area and symmetry analysis to determine if the bonding is defective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a pulling inspection method is used to measure tensile strength of wire bonding, then tensile strength can be measured, but the wire bonding portion is destroyed and only sampling inspection is possible
Solution Approach 1:
The patent replaces the mechanical pulling inspection method with an optical imaging system. A camera captures images of the bonding portion, and image processing algorithms calculate the bonding area and detect defects. This substitution eliminates the destructive nature of mechanical pulling while maintaining measurement capability through non-contact optical measurement.
Solution Approach 2:
The patent creates a visual copy (image) of the bonding portion using a camera. Instead of physically testing the original wire bonding, the system analyzes a replicated visual representation through image processing. This copying approach allows multiple measurements without damaging the actual bonding, enabling full inspection rather than sampling.
2Productivity
If conventional inspection methods are used, then some products can be sampled for inspection, but it is not possible to accurately detect underbonding defects
Solution Approach 1:
The patent enables continuous inspection of all wire bonding portions by implementing a non-destructive imaging system. Unlike sampling methods that interrupt production, this system can continuously capture and analyze images of every bonding portion without stopping the manufacturing process or destroying products, achieving both high productivity and complete coverage.
Solution Approach 2:
The patent replaces mechanical sampling inspection with automated optical imaging and image processing. This substitution allows every product to be inspected rapidly and accurately without the time-consuming manual handling and physical testing required by conventional methods, simultaneously improving both throughput and detection accuracy.
3Ease of manufacture
If gold wire bonding using thermal ultrasonic method is used in semiconductor process, then bonding can be achieved, but a different inspection method is required for battery systems due to shape and area differences
Solution Approach 1:
The patent develops a universal inspection system based on optical imaging that can accommodate different wire bonding types (gold, aluminum, copper) and different applications (semiconductor, battery systems). The image processing algorithm adapts to various bonding portion shapes and sizes, making the system versatile across multiple manufacturing contexts without requiring method-specific adjustments.
Data Source
AI summary
A non-destructive wire bonding inspection method is provided to inspect whether a wire bonding applied to a battery system is defective. The method includes a) photographing a wire bonding portion using a camera, b) calculating the area of the wire bonding portion, and c) determining whether the wire bonding is defective based on the calculated area of the wire bonding portion.