Wire Bonding Array Layout for Space-Saving Workpiece Handling
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Solution Overview
Problem
The resource-intensive nature of material handling in semiconductor packaging, particularly in wire bonding systems, requires substantial factory floor space for workpiece handling, necessitating a reduction in the space required for facilitating access to each wire bonding system.
Innovation Solution
A wire bonding array is introduced, comprising a plurality of wire bonding systems with integrated input and output workpiece handling systems, utilizing a robot with a carriage that moves above the systems, minimizing the footprint by arranging systems back-to-back and employing a robot support structure to reduce space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a material handler provides and removes workpieces from each wire bonding system individually, then workpiece handling is facilitated, but substantial factory floor space is required
Solution Approach 1:
Multiple wire bonding systems are arranged back-to-back in a shared array configuration, eliminating the need for separate material handling access space for each individual system. A single robot service station serves multiple systems simultaneously, merging the material handling function across the entire array rather than requiring dedicated space for each system.
Solution Approach 2:
The robot carriage moves along an overhead rail structure positioned above the wire bonding systems, transitioning material handling from a ground-level operation requiring lateral access space to an overhead operation that utilizes vertical space. This dimensional change allows workpiece delivery without consuming additional factory floor space.
2Ease of operation
If wire bonding systems are arranged to allow access for material handlers, then workpiece delivery is enabled, but factory floor space increases
Solution Approach 1:
The wire bonding systems are configured with back-to-back arrangements where the input magazine handlers are accessible from the same side. Material handlers can service multiple systems in sequence from a single access point, and the robot automation provides self-service workpiece delivery to all systems in the array without requiring additional handler intervention or access space.
3Productivity
If a robot is integrated into the wire bonding array for automated workpiece delivery, then labor efficiency is improved, but system complexity increases
Solution Approach 1:
The robot service station is designed as a multi-functional unit that can service multiple wire bonding systems within the array. The single robot with programmable carriage movement performs workpiece delivery to various systems, magazine replacement, and system maintenance tasks, consolidating what would otherwise require multiple specialized devices into one universal platform.
Data Source
AI summary
A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including (i) an input workpiece handling system and (ii) a bond head assembly configured to carry a wire bonding tool. The wire bonding array also includes a robot configured to provide workpieces to the input workpiece handling system of each of the plurality of wire bonding systems, the robot including a carriage for moving with respect to the plurality of wire bonding systems, the carriage being positioned above a receiving portion of the input workpiece handling system.