Wire Bonding Device Auto-Debugging Defective Wire via Carrier Region
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Solution Overview
Problem
Conventional wire bonding processes are hindered by issues such as undesired material residue and abnormal ball formations leading to poor eutectic bonding and ball lift problems, which cause operational disruptions and reduce production efficiency.
Innovation Solution
A wire bonding device with a carrier having distinct regions for bonding and debugging, where a movement member and bonding member cooperate to remove defective bonding wires by bending and reattaching them to a bondable block, allowing for auto-debugging and improving production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonding process is used, then bonding wire connects bonding points, but defective bonding wire causes ball lift problem and operational disruption
Solution Approach 1:
The patent applies preliminary action by providing a debug region on the carrier before actual wire bonding operations. When a bonding wire defect is detected, the system can immediately re-bond the wire to the debug region without halting production, preventing operational disruptions and maintaining continuous productivity while ensuring bonding reliability
Solution Approach 2:
The debug region acts as an intermediary element between the defective bonding wire and the bonding process. It provides a temporary bonding target that allows the bonding member to complete its cycle and clear the defect without stopping the production line, thus maintaining productivity while preserving bonding quality
2Reliability
If bonding member stops for repair, then bonding quality is maintained, but production efficiency is reduced
Solution Approach 1:
The system applies self-service by enabling the bonding member to automatically handle defective wires through the debug region without requiring external intervention or repair. The bonding member can re-bond defective wires to the debug region and then clear them, allowing the system to service itself and maintain continuous operation without time loss
Solution Approach 2:
The patent implements discarding and recovering by allowing the bonding member to transfer defective bonding wires to the debug region, clear them from the bonding process, and then resume normal operations. This enables the system to discard defective wires without halting production, maintaining both bonding quality and operational efficiency
Data Source
AI summary
A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.