Wire Bonding Ball Diameter Inspection for Quality Checking

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Solution Overview

Problem

Conventional methods for checking the quality of wire bonding are inadequate.

Innovation Solution

A system and method that acquires and inspects the diameter of the pressure-bonded ball in wire bonding, using a controller to store and analyze this information to determine the quality of the bonding process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional wire bonding quality checking methods are used, then the inspection process is simple, but the accuracy and reliability of quality assessment is insufficient

Engineering Contradiction:

Improvequality inspection accuracyVSAvoidinspection system complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical/optical inspection methods with non-contact electromagnetic measurement. The measurement device uses electromagnetic fields to detect ball diameter without physical contact, eliminating mechanical interference and improving measurement precision while maintaining relatively simple device structure

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a storage unit as an intermediary between the measurement device and the evaluation unit. Measurement results are stored and then retrieved for quality assessment, allowing decoupling of measurement and evaluation processes while improving overall inspection accuracy

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If detailed measurement of pressure-bonded ball diameter is implemented, then quality inspection accuracy improves, but measurement and detection difficulty increases

Engineering Contradiction:

Improveball diameter measurement accuracyVSAvoidmeasurement difficulty

Core Design Contradiction:

Measurement precisionVSDifficulty of detecting and measuring

Solution Approach 1:

The patent employs non-contact electromagnetic measurement to detect ball diameter, avoiding the difficulties of mechanical measurement such as contact interference, sampling damage, and operational complexity. The electromagnetic field penetrates through materials to measure the ball diameter accurately without physical access

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The measurement device automatically performs ball diameter detection and stores results without requiring manual intervention. The system self-calibrates and self-measures, reducing the skill level and effort required for operation while maintaining high measurement precision

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS12489003B2Wire bonding system, inspection device, wire bonding method, and recording medium

Publication Date: 2025.12.02 YAMAHA ROBOTICS CO LTD

AI summary

A wire bonding system according to the present invention comprises: an acquisition unit that acquires information pertaining to the diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding; a first storage unit that stores the information pertaining to the pressure-bonded ball diameter which has been acquired by the acquisition unit; and an inspection unit that inspects the quality of wire bonding on the basis of the information pertaining to the pressure-bonded ball diameter which has been read from the first storage unit. With the wire bonding system, it is possible to enhance convenience in a method for checking the quality of wire bonding.