Wire Bonding Capillary Horizontal Disconnection
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Solution Overview
Problem
In wire bonding, the alignment of the wire feed guide with the connecting direction can lead to decreased bonding strength at both the first and second bonding points due to misalignment, and disconnection methods like vertical pulling often result in wire curling or separation from the bonding target, reducing the bonding strength.
Innovation Solution
A wire-bonding apparatus and method using a capillary with a damper and controller to perform specific operations such as first and second bonding, disconnection, preliminary bonding, and shaping, ensuring alignment and bonding strength by moving the capillary within a horizontal plane and using a folding station to shape the wire into a flexed shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the wire is disconnected by moving the capillary vertically upward from the bonding target, then the wire can be easily separated from the bonding target, but the wire curls or separates from the bonding target reducing bonding strength
Solution Approach 1:
The patent changes the disconnection direction from vertical (Z-axis) to horizontal (X-Y plane). The capillary moves horizontally within the bonding plane to disconnect the wire, preventing vertical pulling that causes wire curling. This dimensional change maintains bonding strength while achieving wire separation.
2Device complexity
If the wire feed guide is misaligned with the connecting direction, then the bonding process can be simplified, but the bonding strength at both first and second bonding points decreases
Solution Approach 1:
The patent introduces a movable wire feed guide that can be dynamically adjusted to align with the connecting direction between bonding targets. This dynamic adjustment mechanism ensures proper wire alignment during bonding while maintaining process simplicity through automated positioning control.
3Device complexity
If the capillary moves only vertically during bonding, then the bonding mechanism is simplified, but the wire cannot be properly shaped or aligned for subsequent bonding operations
Solution Approach 1:
The patent adds horizontal movement capability to the capillary, enabling it to move not only vertically (Z-axis) but also horizontally (X-Y plane). This multi-dimensional movement allows the capillary to perform both bonding operations and wire shaping/alignment functions, achieving precise wire positioning without complicating the fundamental vertical bonding mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures consistent bonding strength at both the first and second bonding points by aligning the wire feed guide with the connecting direction and preventing wire curling or separation, thereby maintaining bond integrity.
Implementation Method 1
moving the capillary within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the bonding target
Implementation Method 2
the wire and the lead are bonded while ultrasonic vibration is applied
Implementation Method 3
a damper configured to hold the wire in a clamped state with respect to the capillary
Data Source
AI summary
Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) inserted; and a controller (80). The controller (80) is configured to execute operations including: a disconnection operation, after the second bonding operation, of moving the capillary through which the wire is inserted within a horizontal plane vertical to an axial direction of the capillary while the wire is held in the clamped state, and thereby disconnecting the wire from the second bonding point; a preliminary bonding operation of feeding the wire from the second bonding point to a predetermined preliminary bonding point, and performing preliminary bonding at the preliminary bonding point; and a shaping operation, after the preliminary bonding operation, of shaping the wire projecting from a tip of the capillary into a predetermined flexed shape.