Wire Bonding Clamp Adjustment Using Semiconductor Floating Detection
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Solution Overview
Problem
Current wire bonding machines face inefficiencies in clamping semiconductor elements due to poor clamping techniques, leading to variable and often suboptimal clamping forces, which affect the quality of wire bonding operations.
Innovation Solution
The method involves detecting the 'floating' of semiconductor elements relative to the support structure at multiple locations and adjusting the clamping force accordingly, using techniques such as force profiling and real-time monitoring to determine and maintain an optimal clamping force profile, thereby ensuring consistent and proper clamping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If trial and error method is used to clamp the semiconductor element, then the operator can eventually achieve acceptable clamping, but the process is time-consuming and results in inconsistent clamping quality
Solution Approach 1:
The system employs floating value detection to provide real-time feedback on clamping quality. By measuring the floating value at multiple locations and comparing it against target ranges, the system automatically adjusts clamping forces to achieve consistent optimal clamping without manual trial and error, thereby improving reliability while reducing setup time.
2Reliability
If uniform clamping force is applied across the semiconductor element, then the clamping mechanism is simple, but it cannot accommodate variations in element characteristics leading to poor clamping at certain locations
Solution Approach 1:
The system implements location-specific clamping forces by detecting floating values at multiple discrete locations across the semiconductor element. Each location can have its own target floating value range, allowing the clamping system to apply differentiated forces tailored to local requirements, thereby improving overall clamping effectiveness without requiring overly complex mechanisms.
Solution Approach 2:
The clamping system transitions from static uniform force application to dynamic adaptive force distribution. By continuously monitoring floating values and adjusting clamping forces in real-time based on detected variations, the system adapts to different semiconductor element characteristics, improving reliability while maintaining manageable complexity through automated control.
3Reliability
If high clamping force is applied to ensure contact, then contact reliability improves, but it may cause damage to the semiconductor element or support structure
Solution Approach 1:
The system performs preliminary floating value detection and analysis before finalizing clamping forces. By identifying locations with high floating values and calculating appropriate target forces in advance, the system ensures adequate contact at critical locations while avoiding excessive force that could cause damage, thereby maintaining contact consistency without harmful effects.
Data Source
AI summary
A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).