Wire Bonding Clamp Multi-Step Raising to Prevent Workpiece Buckling
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Solution Overview
Problem
Conventional wire bonding machines experience non-uniform heat expansion of workpieces leading to buckling and undesirable vibrations during the unclamping process, causing contact issues between wire loops and clamping elements, which results in damage and inefficiency.
Innovation Solution
Implementing a method where the device clamp and heat block are raised or lowered in multiple steps, with an initial open position held for a predetermined time before reaching the full open position, allowing the workpiece to settle and reducing distortion and vibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the device clamp and heat block are quickly moved to full open positions after bonding, then productivity is improved, but workpiece distortion and vibration increase causing wire loop damage
Solution Approach 1:
The opening motion of the device clamp and heat block is segmented into multiple stages: first moving to an intermediate position, holding temporarily, then moving to full open position. This segmentation allows controlled release of clamping force to prevent workpiece buckling while maintaining overall productivity.
Solution Approach 2:
The device clamp and heat block are preliminarily moved to intermediate open positions before reaching full open positions. This preliminary action allows the workpiece to begin settling and reduces thermal gradients before complete release, preventing sudden buckling and vibration.
2Ease of operation
If the device clamp is raised quickly to clear the workpiece, then ease of operation is improved, but contact between wire loops and clamp occurs causing damage
Solution Approach 1:
The clamp raising operation is divided into two distinct phases: raising to an intermediate height first, then raising to full open position after a temporary hold. This prevents sudden contact with wire loops while ensuring adequate clearance is eventually achieved.
Solution Approach 2:
The temporary hold at intermediate position acts as a cushioning phase, allowing the workpiece and wire loops to settle before the clamp reaches full open position. This prevents harmful contact while maintaining operational efficiency.
3Productivity
If the heat block is lowered quickly to open position, then productivity is improved, but non-uniform heat expansion causes workpiece buckling
Solution Approach 1:
The heat block lowering motion is segmented into two steps: lowering to an intermediate position first, holding temporarily, then lowering to full open position. This controlled approach allows uniform heat dissipation and prevents workpiece buckling while maintaining cycle efficiency.
Solution Approach 2:
The heat block is preliminarily lowered to an intermediate position before full open position, allowing gradual heat release and workpiece cooling. This preliminary action prevents thermal shock and non-uniform expansion that would cause buckling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes workpiece distortion and associated vibrations, reducing damage to wire loops and ensuring smooth indexing by providing adequate clearance, thus enhancing the operational efficiency of wire bonding machines.
Implementation Method 1
non-uniform heat expansion of workpiece 100
Data Source
AI summary
A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.