Wire Bonding Clamper Corrosion Prevention via Switched Detection Circuit

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Solution Overview

Problem

Conventional wire bonding apparatuses experience electrolytic corrosion on the clamper due to secondary electrical discharges, which damages the wire and prevents secure electrical connections for non-bonding detection.

Innovation Solution

A wire bonding apparatus with a spool, clamper, torch electrode, high-voltage power supply circuit, non-bonding detection circuit, and changeover switches that control the flow of electrical discharges to prevent secondary discharges and enable non-bonding detection by switching between high-voltage power supply and detection circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single clamper is used for both electrical connection and wire cutting, then device complexity is reduced, but electrolytic corrosion occurs on the clamper surface due to secondary electrical discharges

Engineering Contradiction:
Improveclamper structureVSAvoidelectrolytic corrosion
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The invention divides the clamper into two separate components: a first clamper dedicated to electrical connection and a second clamper dedicated to wire cutting. This segmentation eliminates secondary electrical discharges between the clamping element and wire, preventing electrolytic corrosion on the second clamper while maintaining the electrical connection function of the first clamper.

Inventive Principle:
Principle #1Segmentation

2Reliability

If high voltage is applied to the clamper for electrical connection, then non-bonding detection can be performed, but electrolytic corrosion still occurs on the clamper surface

Engineering Contradiction:
Improvenon-bonding detectionVSAvoidelectrolytic corrosion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention separates the electrical connection function from the wire cutting function by using two distinct clamps. The first clamper handles electrical connection and can withstand high voltage for non-bonding detection, while the second clamper handles wire cutting without being exposed to high voltage, thus avoiding electrolytic corrosion.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first clamper acts as an intermediary that conducts high voltage for non-bonding detection without transferring it to the second clamper. The electrical connection path is established through the first clamper, preventing secondary discharges that would cause corrosion on the wire-cutting clamper.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If separate clamps are used for electrical connection and wire cutting, then electrolytic corrosion is prevented, but device complexity increases

Engineering Contradiction:
Improveelectrolytic corrosionVSAvoidclamper structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The first clamper performs multiple functions: it provides electrical connection during wire bonding and enables non-bonding detection through high voltage application. This multi-functionality justifies the addition of the second specialized clamper, as the first clamper handles both electrical tasks.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent describes a wire bonding apparatus where the control unit automatically manages the switching between bonding and non-bonding detection modes, and the system self-regulates the high voltage application timing. This automation reduces the operational complexity despite the added hardware component.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Inhibits electrolytic corrosion of the clamper and allows for reliable non-bonding detection with a simple configuration, ensuring secure connections between wires and devices or substrates.

Implementation Method 1

generating electrical discharges between the wire and the electric torch to melt the wire

Methodology Applied
Scientific EffectElectrical discharges: Electric Arc

Implementation Method 2

applying a high voltage for forming a free air ball to the wire, and generating electrical discharges between the wire and the electric torch to melt the wire

Methodology Applied
Scientific EffectElectrical discharge heating: Joule Heating

Data Source

PatentUS10964661B2Wire bonding apparatus, circuit for wire bonding apparatus, and method for manufacturing semiconductor device
Publication Date: 2021.03.30 YAMAHA ROBOTICS CO LTD
  • US10964661B2 patent drawing
  • US10964661B2 patent drawing
  • US10964661B2 patent drawing

AI summary

The present invention comprises: a spool (10); a clamper (22); a torch electrode (31); a high-voltage power source circuit (30); a non-bonding detection circuit (40); a first changeover switch (50) switching a connection between the spool (10) and the high-voltage power source circuit (30) or the non-bonding detection circuit (40); and a relay (53) turning on/off a connection between the clamper (22) and a spool side of the first changeover switch (50), and comprises a control part (60) that sets the first changeover switch (50) to the high-voltage power source circuit side and turns off the relay (53) to generate electric discharge, and that sets the first changeover switch (50) to the non-bonding detection circuit side and turns on the relay (53) to perform non-bonding detection. Due to this configuration, electric corrosion of a wire clamper can be suppressed and non-bonding detection can be carried out with a simple configuration.