Ultrasonic Wire Bonding Clamping Position Verification

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Solution Overview

Problem

In ultrasonic wire bonding, the close proximity of clamping structures to semiconductor dies during bonding operations can result in damage to the dies, as existing clamping methods lack effective mechanisms to ensure safe and precise positioning.

Innovation Solution

An ultrasonic bonding machine equipped with an imaging system and a computer that determines the relative position of semiconductor elements and clamping structures using predetermined criteria, preventing damage by alerting operators or triggering corrective actions before bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If clamping structures are positioned close to the semiconductor die to provide strong clamping forces, then clamping effectiveness is improved, but the risk of damage to the semiconductor die increases

Engineering Contradiction:

Improveclamping forceVSAvoiddie damage risk

Core Design Contradiction:

ForceVSObject-affected harmful factors

Solution Approach 1:

The system performs preliminary imaging and position determination of the semiconductor die and clamping structure before the bonding operation. The computer evaluates whether the relative position is acceptable using predetermined criteria, preventing damage by alerting operators or triggering corrective actions before the clamping force is applied

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The imaging system captures images of the semiconductor die and clamping structure, and the computer provides feedback by determining whether the relative position is acceptable. This feedback loop allows the system to detect potential positioning issues and prevent damage before it occurs

Inventive Principle:

Principle #23Feedback

2Force

If clamping structures are positioned close to the semiconductor die, then clamping effectiveness is improved, but positioning precision requirements increase

Engineering Contradiction:

Improveclamping forceVSAvoidpositioning precision

Core Design Contradiction:

ForceVSManufacturing precision

Solution Approach 1:

The patent replaces manual positioning and mechanical alignment with an automated imaging system and computer-based evaluation. The imaging system captures precise position information, and the computer determines acceptability based on predetermined criteria, eliminating the need for manual precision positioning while maintaining effective clamping

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS10763236B2Systems and methods of operating wire bonding machines including clamping systems

Publication Date: 2020.09.01 KULICKE & SOFFA IND INC

AI summary

A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).