Wire Bonding Contact Detection and Automatic Recovery
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Solution Overview
Problem
The increasing integration of semiconductor chips requires faster bonding equipment to manage the growing number of bonding wires efficiently, but existing methods often experience temporary suspensions due to poor contact, leading to reduced manufacturing efficiency.
Innovation Solution
An automatic recovery process is integrated into the wire bonding method, which includes applying electrical signals to detect contact between the bonding wire and connection pads, adjusting the clamp state to prevent separation, and performing an automatic recovery process to maintain continuous operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If faster bonding equipment is used to increase productivity, then the number of bonding wires can be managed efficiently, but temporary suspensions occur due to poor contact, reducing manufacturing efficiency
Solution Approach 1:
The patent implements a feedback mechanism where the bonding equipment automatically detects poor contact conditions through electrical signal application and resistance measurement. When poor contact is detected, the system automatically adjusts bonding parameters or repositions components without manual intervention, creating a closed-loop control system that maintains reliability at high speeds
Solution Approach 2:
The patent applies preliminary actions by performing contact verification through electrical signal application before completing the bonding process. The system also pre-adjusts bonding parameters based on predicted contact conditions and performs preliminary positioning adjustments to prevent poor contact before it occurs, enabling faster operation without sacrificing reliability
2Reliability
If manual intervention is used to resolve poor contact, then contact reliability can be maintained, but operation rate decreases due to temporary suspensions
Solution Approach 1:
The bonding equipment performs self-diagnosis and self-correction through automatic detection of poor contact conditions using electrical signal application. The system automatically adjusts bonding parameters, repositions components, or retries bonding operations without requiring manual intervention, enabling the equipment to maintain reliability while operating continuously at high speed
Solution Approach 2:
The patent implements continuous operation by automatically resolving poor contact conditions during the bonding process. The system maintains continuous bonding action through automatic parameter adjustment and retry mechanisms, eliminating temporary suspensions and manual interventions that would interrupt the useful action and reduce operation rate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the operation rate of bonding equipment, increasing manufacturing efficiency and productivity by preventing temporary suspensions and ensuring continuous bonding wire formation.
Implementation Method 1
applying a first electrical signal to the wire to detect whether the wire and the connection pad are in contact with each other
Data Source
AI summary
A wire bonding method includes bonding a tip of a wire provided through a clamp and a capillary onto a bonding pad of a chip, moving the capillary to a connection pad of a substrate corresponding to the bonding pad, bonding the wire to the connection pad to form a bonding wire connecting the bonding pad to the connection pad, before the capillary is raised from the connection pad, applying a electrical signal to the wire to detect whether the wire and the connection pad are in contact with each other, changing a state of the clamp to a closed state when the wire is not in contact with the connection pad and maintaining the state of the clamp in an open state when the wire is in contact with the connection pad, and raising the capillary from the connection pad while maintaining the state of the clamp.