Wire Bonding Covers for Semiconductor Connection Reliability
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Solution Overview
Problem
Power semiconductor devices face issues with detached or broken wire ends at bonding areas, leading to loss or deterioration of electrical and mechanical connections, which compromises process reliability.
Innovation Solution
The implementation of bonding covers over wire ends and bond areas using conductive or non-conductive epoxy materials, ensuring secure electrical connections and preventing defects like wire lift and heel cracks, with a low-temperature curing process to avoid component damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed to connect die and bond post, then electrical connection is established, but wire ends may become detached or broken leading to connection deterioration
Solution Approach 1:
The patent applies bonding covers (solder or epoxy) over the wire ends and bond areas before defects can occur. This protective layer acts as a cushion that prevents wire lift, heel cracks, and detachment, thereby maintaining connection reliability and bond strength throughout the device lifecycle.
2Strength
If bonding covers are applied to protect wire ends, then bond strength increases, but manufacturing process complexity increases
Solution Approach 1:
The patent combines the bonding cover application step with the existing wire bonding process flow. By integrating the protective cover application into the standard manufacturing sequence, the process achieves enhanced bond strength without proportionally increasing overall manufacturing complexity.
3Strength
If high temperature curing is used to apply bonding material, then bonding cover adhesion improves, but component damage may occur
Solution Approach 1:
The patent employs low-temperature curing processes for the bonding material, changing the thermal parameter from conventional high-temperature curing to a lower temperature range. This parameter change achieves sufficient bonding cover adhesion while preventing thermal damage to sensitive semiconductor components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances bond strength by up to 70% and prevents defects, thereby improving process reliability and maintaining electrical connections.
Implementation Method 1
applying a bonding material over the first bond area to form a first bonding cover, and applying the bonding material over the second bond area to form a second bonding cover
Data Source
AI summary
A semiconductor device includes a die pad, a bond post, a die disposed over the die pad, a wire coupled between the die and the bond post and having a first portion bonded to the die at a first bond area and a second portion bonded to the bond post at a second bond area, a first bonding cover disposed over the first portion, and a second bonding cover disposed over the second portion. A method includes bonding a first portion of a wire to a die at a first bond area, bonding a second portion of the wire to a first bond post of a lead frame at a second bond area, applying a bonding material over the first bond area to form a first bonding cover, and applying the bonding material over the second bond area to form a second bonding cover.