Wire Bonding Cutter Stop Position Control
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Solution Overview
Problem
In semiconductor device manufacturing, the miniaturization of power devices is hindered by the difficulty in ensuring sufficient space for wedge bonding tools due to the need for precise cutting of large-diameter Al wires, which complicates the wire cutting process and limits device miniaturization.
Innovation Solution
A semiconductor device manufacturing method that involves using a cutter attached to the same drive section as the wedge, allowing for wire cutting by leaving the wedge withdrawn from the lead section, with a stopper determining the cutter's stop position, thereby eliminating the need for space under the wedge and enabling miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the wedge is seated on the lead section to stabilize the cutter stop position, then the wire cutting precision is improved, but the lead section length increases due to the required space for the wedge
Solution Approach 1:
The invention divides the stop position determination function into two independent components: the wedge provides the stop position reference during bonding, while the cutter stops at a fixed position relative to the wedge's initial position. This segmentation allows the cutter to stop precisely without requiring the wedge to be seated on the lead section during cutting, thereby reducing the required lead section length while maintaining cutting precision.
Solution Approach 2:
The wedge position is predetermined and set before the cutting operation. The stop position for the cutter is established in advance based on the wedge's initial position, allowing the cutter to stop at the correct location without requiring the wedge to occupy space on the lead section during the cutting process.
2Volume of moving object
If the lead section length is reduced for device miniaturization, then the device size is decreased, but the space required for seating the wedge during wire cutting becomes insufficient
Solution Approach 1:
The invention separates the bonding function (performed by the wedge) from the cutting function (performed by the cutter). The wedge establishes a reference position before bonding, and the cutter uses this reference to determine its stop position. This segmentation allows the cutting operation to be performed without the wedge occupying space on the lead section, enabling miniaturization while maintaining ease of manufacture.
Solution Approach 2:
The wedge acts as an intermediary that provides a reference position for the cutter. By establishing this reference before bonding and allowing the cutter to stop at a fixed position relative to it, the system enables precise cutting without requiring the wedge to be physically present on the lead section during cutting, thus facilitating device miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for effective wire cutting without requiring additional space for the wedge, reducing the lead section's length and promoting semiconductor device miniaturization while maintaining reliable bonding.
Implementation Method 1
electrically coupling together each electrode pad of the semiconductor chip and each Al wire by a wedge as a bonding tool and pressing the Al wire against the lead section by the wedge
Implementation Method 2
lowering a cutter member and cutting the Al wire by the cutter member
Data Source
AI summary
In wire bonding in assembling of a semiconductor device, an Al wire is coupled to a lead section by a wedge which is a bonding tool, thereafter, the wedge is withdrawn from the top of the lead section and a cutter is lowered and the Al wire is cut off in this state. Lowering of the cutter is stopped at a point in time that a stopper which is lowered simultaneously with lowering of the cutter has truck against the lead section and cutting of the Al wire is terminated by stopping of lowering of the cutter.