Wire Bonding Cutting Blade With Stepped Tip

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Solution Overview

Problem

Conventional cutting blades used in wire and ribbon bonding operations often pierce and damage the underlying semiconductor die during the cutting process, leading to defects and operational problems.

Innovation Solution

A cutting blade with a stepped portion proximate the blade tip is designed to limit penetration, preventing the blade from piercing the semiconductor die by resisting further penetration once the desired cut depth is reached.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a cutting blade is used to cut the conductive material, then the wire loop can be severed from the supply, but the blade tip may pierce and damage the underlying semiconductor die

Engineering Contradiction:
Improvecutting capabilityVSAvoiddie damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The cutting blade incorporates a stepped portion with different penetration depths at different locations. The first location has a greater penetration depth for effective cutting, while the second location has a lesser penetration depth to prevent die damage. This local differentiation of penetration depth allows the blade to perform its cutting function while avoiding harmful effects on the die.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the blade tip penetrates deeply into the conductive material to ensure complete cutting, then cutting effectiveness is improved, but the risk of piercing the die increases

Engineering Contradiction:
Improvecut depth controlVSAvoiddie integrity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The cutting blade is segmented into multiple locations along its length, with each location having a different penetration depth. This segmentation allows the blade to provide effective cutting at the first location while the second location serves as a depth limit to prevent die piercing, thus controlling cut depth precision while maintaining die integrity.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8141765B2Cutting blade for a wire bonding system
Publication Date: 2012.03.27 KULICKE & SOFFA IND INC
  • US8141765B2 patent drawing
  • US8141765B2 patent drawing
  • US8141765B2 patent drawing

AI summary

A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proximate the blade tip that is configured to limit penetration of the blade tip during use thereof.