Wire Bonding System with Dual Positioning Tables for Parallel Operations
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Solution Overview
Problem
Conventional wire bonding systems have lower units per hour (UPH) due to sequential operations that include loading/unloading and pattern recognition, which consume time and cannot be eliminated, limiting productivity.
Innovation Solution
A wire bonding system with separate positioning tables that allow independent movement between loading/unloading and bonding positions, enabling simultaneous performance of productive bonding operations with non-productive operations like loading/unloading and pattern recognition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential operations are used in a single worktable wire bonding system, then device bonding is performed, but units per hour (UPH) is reduced due to time-consuming non-productive operations
Solution Approach 1:
The system divides the worktable into multiple independent positioning tables (first positioning table, second positioning table, etc.), each capable of independent operation. This segmentation allows different tables to perform different operations simultaneously - one table can be bonding while another is loading/unloading, thereby reducing the time loss from sequential operations and increasing UPH
Solution Approach 2:
By having multiple positioning tables that can operate independently and simultaneously, the system ensures that the bonding operation continues without interruption. While one table is performing bonding, another table can be loading or unloading devices, eliminating idle time and maintaining continuous productive action across the system
2Productivity
If multiple positioning tables are used to perform bonding and loading/unloading simultaneously, then UPH is increased, but device complexity increases
Solution Approach 1:
Each positioning table is designed as a multi-functional unit that can perform multiple operations (bonding, loading, unloading) independently. This universality allows the system to achieve high productivity through parallel operations while keeping each individual table relatively simple in design, as each table is a standardized module that can be replicated
Solution Approach 2:
The system transitions from a single-table sequential approach to a multi-table parallel approach, adding the dimension of temporal parallelism. By distributing operations across multiple tables that can be positioned at different locations (bonding position, loading position, unloading position), the system achieves simultaneous execution of multiple operations without significantly increasing the complexity of individual components
Data Source
AI summary
A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.