Wire Bonding Machine Fault Detection via Segmented Algorithm Parameters
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Solution Overview
Problem
Current wire bonding machines use a single operation algorithm with a wide allowable current range, leading to abnormal conductive wires being misclassified as normal, resulting in potentially costly discarding of multi-chip semiconductor packages.
Innovation Solution
A method and apparatus that set individual bond parameters for each operation algorithm based on design data, allowing for accurate detection of faults by comparing actual data with pre-set parameters, specifically grouping conductive wires by electrical connecting functions and setting parameters for primary and secondary operation algorithms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single operation algorithm with a wide allowable current range is used in the wire bonding machine, then the machine can form conductive wires with different electrical connecting functions using the same algorithm, but abnormal conductive wires may be misclassified as normal leading to defective semiconductor packages
Solution Approach 1:
The patent segments the single operation algorithm into multiple operation algorithms (first operation algorithm for first conductive wires, second operation algorithm for second conductive wires). Each operation algorithm has its own specific bond parameters and allowable ranges tailored to the electrical connecting functions of the corresponding conductive wires. This segmentation enables accurate detection of abnormal conductive wires while maintaining adaptability to different wire types.
Solution Approach 2:
The patent applies local quality by setting different bond parameters and allowable ranges for different operation algorithms based on the specific electrical connecting functions of the conductive wires they form. Instead of using a uniform wide range for all wires, each operation algorithm has locally optimized parameters that match the requirements of the specific wire type, thereby improving detection accuracy without sacrificing versatility.
2Adaptability or versatility
If a wide allowable current range is set for the operation algorithm, then the machine can accommodate variations in conductive wire formation, but abnormal conductive wires cannot be properly detected
Solution Approach 1:
The patent divides the single wide allowable current range into multiple narrower ranges, each associated with a specific operation algorithm. The first operation algorithm has a first allowable current range for first conductive wires, and the second operation algorithm has a second allowable current range for second conductive wires. This segmentation maintains adaptability to variations within each wire type while improving measurement precision for fault detection.
Solution Approach 2:
The patent changes the bond parameters (specifically current ranges) based on the operation algorithm being used. By adjusting the allowable current range according to the specific electrical connecting function and wire type, the system maintains adaptability to normal variations while achieving precise detection of abnormal conditions that fall outside the specific range for each operation algorithm.
3Reliability
If individual bond parameters are set for each operation algorithm based on design data, then faults can be accurately detected, but the device complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-setting the bond parameters and allowable ranges in the wire bonding machine based on design data before actual wire bonding operations begin. The system stores the first bond parameters and first allowable range for the first operation algorithm, and the second bond parameters and second allowable range for the second operation algorithm. This preliminary configuration reduces operational complexity during actual use, as the parameters are automatically selected based on the operation algorithm being executed.
Solution Approach 2:
The patent uses design data (which is a copy or representation of the intended wire bonding specifications) to set the actual bond parameters in the machine. By copying the required parameters from design data into the operation algorithms, the system achieves accurate fault detection while managing complexity through automated parameter management rather than manual configuration.
Data Source
AI summary
In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.