Wire Bonding Continuity Detection to Prevent Wire Fly-Out
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Solution Overview
Problem
Wire bonding systems face challenges in detecting and preventing early separation of bonded wire portions from the wire supply, leading to potential wire fly out errors.
Innovation Solution
Implementing a detection system that monitors electrical continuity or impedance between the bonded wire and the wire supply, and automatically closing a wire clamp to secure the wire supply if separation is detected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed without continuous monitoring, then the bonding process can proceed quickly, but wire separation may occur undetected leading to wire fly out errors
Solution Approach 1:
The patent implements a detection system that continuously monitors wire integrity during the bonding process by measuring electrical continuity between the wire supply and the bonding location. When separation is detected, the system provides feedback to stop the wire feed, preventing wire fly out errors. This feedback mechanism enhances reliability without significantly increasing overall system complexity.
Solution Approach 2:
The patent replaces complex mechanical monitoring systems with an electrical continuity-based detection system. Instead of using mechanical sensors to detect wire separation, the system uses electrical measurements to monitor wire integrity, simplifying the detection mechanism while maintaining high reliability.
2Reliability
If a detection system is implemented to monitor wire continuity, then wire separation can be detected early, but the system complexity and cost increase
Solution Approach 1:
The detection system is integrated into the existing wire bonding system, allowing the same electrical connections used for bonding to also serve for continuity monitoring. This multi-functionality approach enables error detection without adding separate dedicated monitoring hardware, thereby limiting the increase in system complexity.
Solution Approach 2:
The wire bonding system monitors its own wire integrity using built-in electrical continuity measurements. The system uses its existing electrical infrastructure to detect wire separation, eliminating the need for external or additional complex monitoring equipment.
3Productivity
If wire separation is not detected promptly, then the bonding process continues uninterrupted, but wire fly out errors occur reducing productivity
Solution Approach 1:
The detection system performs preliminary monitoring of wire continuity before wire separation can cause fly out errors. By detecting separation early in the process, the system can stop wire feed promptly, preventing the harmful effect while maintaining continuous productive operation.
Solution Approach 2:
The system rapidly detects and responds to wire separation events, minimizing the time window during which wire fly out can occur. The quick detection and immediate cessation of wire feed allows the bonding process to skip over potential error conditions, maintaining overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of wire fly out by promptly addressing early separation issues, enhancing the efficiency and reliability of wire bonding processes.
Implementation Method 1
the detection system monitors electrical continuity between the portion of wire and the wire supply during step (b)
Implementation Method 2
the detection system monitors impedance between the portion of wire and the wire supply during step (b)
Implementation Method 3
varying types of bonding energy may be used, for example, ultrasonic energy
Implementation Method 4
varying types of bonding energy may be used, for example, ultrasonic energy, thermosonic energy
Implementation Method 5
varying types of bonding energy may be used, for example, ultrasonic energy, thermosonic energy, thermocompressive energy
Data Source
AI summary
A method of operating a wire bonding system is provided. The method includes the steps of: (a) forming a wire bond between (i) a portion of wire and (ii) a bonding location of a workpiece using a wire bonding tool; and (b) detecting if the portion of wire separates from a wire supply during step (a).