Wire Bonding Gas Delivery Mechanism for Oxidation Control
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Solution Overview
Problem
Existing wire bonding technologies face challenges in reducing oxidation of reactive metals like copper, silver, and palladium during the bonding process, leading to undesirable oxide formation at the bond site and free air ball formation areas.
Innovation Solution
A gas delivery mechanism that provides a cover gas, such as nitrogen or argon, to both the bond site area and the free air ball formation area of a wire bonding machine, reducing the potential for oxidation by creating a protective environment during the wire bonding operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single gas delivery mechanism provides cover gas to both bond site area and free air ball formation area, then device complexity is reduced and cost is lowered, but gas delivery uniformity and oxidation protection effectiveness may be compromised
Solution Approach 1:
The gas delivery mechanism is segmented into multiple independent gas delivery channels, with at least one channel dedicated to the bond site area and another to the free air ball formation area. Each channel can be independently controlled to deliver cover gas at appropriate flow rates and timing, ensuring reliable oxidation protection while maintaining reasonable system complexity
Solution Approach 2:
The gas delivery mechanism is designed with multi-functionality to serve both the bond site area and free air ball formation area through a single integrated system. The mechanism can switch between different delivery modes and adjust flow parameters to meet the distinct requirements of each area, reducing overall device complexity while maintaining protection effectiveness
2Object-affected harmful factors
If cover gas is provided to free air ball formation area during EFO operation, then oxidation of wire end is reduced, but additional device complexity and space requirements are introduced
Solution Approach 1:
The gas delivery subsystem for the free air ball formation area is merged with the overall gas delivery mechanism in an integrated manner. The same mechanism that delivers cover gas to the bond site area also delivers cover gas to the free air ball formation area, eliminating the need for separate subsystems and reducing overall device complexity and space requirements
Solution Approach 2:
A gas delivery mechanism acts as an intermediary between the gas source and both processing areas. This intermediary system intelligently distributes cover gas to where it is needed most, providing oxidation protection at the free air ball formation area during EFO operation without requiring direct, separate gas delivery infrastructure to each area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes oxidation, ensuring reliable wire bonds by maintaining a controlled gas supply that reduces oxide formation on wires and wire ends, enhancing the bonding process efficiency and reducing costs associated with multiple gas delivery systems.
Implementation Method 1
These more reactive metals may react, for example, in the presence of oxygen and form oxides/oxidation on the wires (and/or wire ends or tails) which are undesirable for wire bonding
Data Source
AI summary
A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.